Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2022/254611
Kind Code:
A1
Abstract:
A cutting tool equipped with a substrate and a film positioned on the substrate, wherein: the film contains a hard carbon film on the outermost surface thereof; the hard carbon film includes a first region; the first region is sandwiched between the surface of the hard carbon film and a virtual plane P, the distance of which from said surface toward the substrate side is 40nm; and an sp2 component amount C2 and an sp3 component amount C3 in the first region satisfy the relationship in formula 1. Formula 1: {C2/(C2+C3)}×100≤2.0
Inventors:
TABAYASHI DAIJI (JP)
FUKUI HARUYO (JP)
UEMURA SHIGEAKI (JP)
FUKUI HARUYO (JP)
UEMURA SHIGEAKI (JP)
Application Number:
PCT/JP2021/021007
Publication Date:
December 08, 2022
Filing Date:
June 02, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23B27/20; B23B27/14
Domestic Patent References:
| WO2018101347A1 | 2018-06-07 | |||
| WO2016190443A1 | 2016-12-01 |
Foreign References:
| JP2009006470A | 2009-01-15 | |||
| JP2009061540A | 2009-03-26 | |||
| JP2015063714A | 2015-04-09 | |||
| JP2003062706A | 2003-03-05 |
Other References:
See also references of EP 4286082A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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