Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2022/264198
Kind Code:
A1
Abstract:
A cutting tool according to the present invention comprises a base material and a film disposed on the base material, wherein: the film includes a first layer; the first layer includes a plurality of crystal grains; the crystal grains comprise AlxTi1-xCyN1-y where x is more than 0.65 but less than 0.95 and y is not less than 0 but less than 0.1; the crystal grains have an average aspect ratio of more than 3.0 but not more than 10.0 in a first region constituted by a region that is sandwiched between a surface S1 of the first layer or an interface S2 of the first layer on the surface side and a first imaginary plane VS1; the crystal grains have an average aspect ratio of not more than 3.0 in a second region constituted by a region that is sandwiched between the first imaginary plane VS1 and an interface S3 of the first layer on the base material side; the first imaginary plane VS1 passes through a point 1 μm from the interface S3 on the surface side and is parallel to the interface S3; the crystal grains include crystal grains with a cubic structure; the percentage of area occupied by the crystal grains with the cubic structure is not less than 90% in the first layer; the average aspect ratio and the percentage of area are measured at a cross section along a normal of the interface between the base material and the film; and the first layer has a thickness of 2-20 μm.
Inventors:
KOBAYASHI FUMIYOSHI (JP)
PASEUTH ANONGSACK (JP)
KIDO YASUKI (JP)
TOMINAGA KOSUKE (JP)
PASEUTH ANONGSACK (JP)
KIDO YASUKI (JP)
TOMINAGA KOSUKE (JP)
Application Number:
PCT/JP2021/022459
Publication Date:
December 22, 2022
Filing Date:
June 14, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23B27/14
Domestic Patent References:
| WO2017175400A1 | 2017-10-12 |
Foreign References:
| JP2013223894A | 2013-10-31 | |||
| JP2020055097A | 2020-04-09 | |||
| JP2017508632A | 2017-03-30 | |||
| JP2016036873A | 2016-03-22 | |||
| JPH08158052A | 1996-06-18 | |||
| JP2014121748A | 2014-07-03 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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