Title:
CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, SINGLE-LAYER RESIN SHEET, LAMINATED RESIN SHEET, PREPREG, METAL-FOIL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2019/198550
Kind Code:
A1
Abstract:
Provided are: a cyanic acid ester compound which can exhibit excellent heat conductivity; a method for producing the cyanic acid ester compound; a resin composition; a cured article; a single-layer resin sheet; a laminated resin sheet; a prepreg; a metal-foil-clad laminated plate; a printed wiring board; a sealing material; a fiber-reinforced composite material; and an adhesive agent. The cyanic acid ester compound according to the present invention is represented by formula (1). In formula (1), R1, R2 and R3 independently represent a monovalent substituent and independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a halogen atom, wherein the case where each of R1, R2 and R3 is a hydrogen atom is excluded; and n, m and l independently represent an integer of 0 to 4.
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Inventors:
NAKANISHI KOHEI (JP)
KATAGIRI SHUNSUKE (JP)
KATAGIRI SHUNSUKE (JP)
Application Number:
PCT/JP2019/014415
Publication Date:
October 17, 2019
Filing Date:
April 01, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C07C261/02; C08J5/24; C08L101/00; C09J179/00
Foreign References:
| JPS6461450A | 1989-03-08 | |||
| JPH024813A | 1990-01-09 |
Other References:
HARADA, MIYUKI ET AL.: "Thermal conductivity of liquid crystalline epoxy/BN filler composites having ordered network structure", C OMPOSITES : PART B, vol. 55, 2013, pages 306 - 313, XP028713104, DOI: 10.1016/j.compositesb.2013.06.031
AKATSUKA, MASAKI ET AL.: "Development of Epoxy Resins with Controlled High Order Structures Having Excellent Heat Release Properties", IEEJ TRANSACTIONS ON FUNDAMENTALS AND MATERIALS, vol. 123, no. 7, 2003, pages 687 - 692, XP055641937
MIMURA, KENJI: "High Heat Conduction Composite Material", JOURNAL OF NETWORK POLYMER, vol. 35, no. 2, 2014, Japan, pages 76 - 83
AKATSUKA, MASAKI ET AL.: "Development of Epoxy Resins with Controlled High Order Structures Having Excellent Heat Release Properties", IEEJ TRANSACTIONS ON FUNDAMENTALS AND MATERIALS, vol. 123, no. 7, 2003, pages 687 - 692, XP055641937
MIMURA, KENJI: "High Heat Conduction Composite Material", JOURNAL OF NETWORK POLYMER, vol. 35, no. 2, 2014, Japan, pages 76 - 83
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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