Title:
DEVICE FOR MACHINING COLUMNAR MEMBER
Document Type and Number:
WIPO Patent Application WO/2012/164757
Kind Code:
A1
Abstract:
Provided is a device for preventing cracks and defects when a substrate composed of a hard brittle crystal material is manufactured. A holding means holds both ends of a workpiece, and the distal end of a polishing brush, which is a machining means, is brought into contact with the workpiece and rotated to thereby remove very small cracks present in the surface layer of the workpiece. Grindstone and polishing-brush machining are used in combination in accordance with the shape and dimensions of the workpiece prior to machining, whereby the shape and dimensions can be adjusted and very small cracks can be removed.
Inventors:
SAWAI SYOUTA (JP)
HIGUCHI MASAO (JP)
HIGUCHI MASAO (JP)
Application Number:
PCT/JP2011/066526
Publication Date:
December 06, 2012
Filing Date:
July 21, 2011
Export Citation:
Assignee:
SINTOKOGIO LTD (JP)
SAWAI SYOUTA (JP)
HIGUCHI MASAO (JP)
SAWAI SYOUTA (JP)
HIGUCHI MASAO (JP)
International Classes:
B28D5/02; B24B1/00; B24B29/00
Foreign References:
| JP2011005604A | 2011-01-13 | |||
| JP2002018711A | 2002-01-22 | |||
| JP2002356341A | 2002-12-13 | |||
| JP2010214550A | 2010-09-30 | |||
| JP2008073828A | 2008-04-03 | |||
| JP2006290697A | 2006-10-26 |
Attorney, Agent or Firm:
YAMASAKI, Yukuzo et al. (JP)
Yukuzo Yamazaki (JP)
Yukuzo Yamazaki (JP)
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Claims: