Title:
DEVICE FOR MANUFACTURING LAYERED BODY, AND METHOD FOR MANUFACTURING LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2014/178390
Kind Code:
A1
Abstract:
Provided are a device for manufacturing a layered body and a method for manufacturing a layered body which are not susceptible to air bubbles remaining between adhered surfaces. The device (1000) is for manufacturing a layered body having a display panel (1), a glass plate (2) facing the display panel (1), and an adhesive layer (3) sandwiched between the display panel (1) and the glass plate (2). The device (1000) has: a support member (10) which modifies the relative distance between the display panel (1) and the glass plate (2) arranged facing the display panel (1) with the adhesive layer (3) therebetween; a first pressure adjustment section (20) which has a space for accommodating the display panel (1), and one end of which is open; and a vacuum pump (30) which controls the pressure of the space surrounded by the first pressure adjustment section (20). The first pressure adjustment section (20) forms a first space (S1) which is partitioned by the first pressure adjustment section (20) and a part of the glass plate (2) by bringing the glass plate (2) into contact with an opening (20a) in the first pressure adjustment section (20) in order to close the opening (20a). The vacuum pump (30) is provided so as to be capable of decreasing the pressure of the first space (S1) to below atmospheric pressure.
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Inventors:
NIIYAMA SATOSHI (JP)
OTA KAZUSHIGE (JP)
BABA TATEO (JP)
OTA KAZUSHIGE (JP)
BABA TATEO (JP)
Application Number:
PCT/JP2014/061912
Publication Date:
November 06, 2014
Filing Date:
April 28, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B32B43/00; C03C27/10; G09F9/00
Domestic Patent References:
| WO2008081838A1 | 2008-07-10 |
Foreign References:
| JP2009122666A | 2009-06-04 | |||
| JPH02310050A | 1990-12-25 | |||
| JPH0336538A | 1991-02-18 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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