Title:
DEVICE TRAY
Document Type and Number:
WIPO Patent Application WO/2023/068138
Kind Code:
A1
Abstract:
Provided is a device tray that reduces the occurrence of chipping during transport or placement. A device tray (101) comprises: a plurality of linear members (102, 103) intersecting with each other; a plurality of openings (104) formed by the plurality of linear members (102, 103) stacked in layers; and a protrusion (106). The protrusion (106) is integrated with the linear members (102, 103) of the outermost layer via an integration member (107). The linear members (102, 103) of the outermost layer are not embedded in the protrusion (106). The integration member (107) is penetrating into the openings (104).
Inventors:
ARIMA TAKASHI (JP)
Application Number:
PCT/JP2022/038053
Publication Date:
April 27, 2023
Filing Date:
October 12, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H01G13/00; B65D85/90
Domestic Patent References:
| WO2016117207A1 | 2016-07-28 |
Foreign References:
| JP2021068771A | 2021-04-30 | |||
| JP2008177188A | 2008-07-31 |
Attorney, Agent or Firm:
ASAMURA IP P.C. (JP)
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