DIP MOLDED ARTICLE WITH LOW SURFACE RESISTIVITY

Title:

DIP MOLDED ARTICLE WITH LOW SURFACE RESISTIVITY

Document Type and Number:

WIPO Patent Application WO/2004/069902

Kind Code:

A1

Abstract:

A dip molded article having a lower surface resistivity than conventional even after cleaned with ultrapure water. The surface resistivity measured in an atmosphere of 20°C and 65% relative humidity is 10⁷ to 10¹⁰ &ohm /square. Since the surface resistivity of the dip molded article is low, it can be preferably applied to a glove for manufacture of precise electronic components and semiconductor components.

Inventors:

KODAMA KAZUMI (JP)
NAKAMURA MISAO (JP)
INOUE TOSHIHIRO (JP)

Application Number:

PCT/JP2004/001000

Publication Date:

August 19, 2004

Filing Date:

February 02, 2004

Export Citation:

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Assignee:

ZEON CORP (JP)
KODAMA KAZUMI (JP)
NAKAMURA MISAO (JP)
INOUE TOSHIHIRO (JP)

International Classes:

A41D19/00; A41D31/00; B29C41/00; B29C41/14; C08J5/02; (IPC1-7): C08J5/02; A41D19/00; B29C41/14

Domestic Patent References:

WO2002002657A2

2002-01-10

Foreign References:

JPH10298384A	1998-11-10
EP1266927A1	2002-12-18
JP2002020915A	2002-01-23
EP1215236A2	2002-06-19

Other References: