Title:
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/063521
Kind Code:
A1
Abstract:
Provided is an elastic wave device in which the occurrence of migration in a wiring electrode or the like is inhibited. Also provided is a method for manufacturing the elastic wave device. The elastic wave device comprises: a first electrode film (2) formed on the upper surface of a piezoelectric substrate (1), the first electrode film constituting an electrode that includes an IDT electrode (3); and a second electrode film (6) formed so as to reach from the upper surface of the piezoelectric substrate (1) to part of the upper surface of the first electrode film (2). The second electrode film (6) constitutes an electrode that includes a wiring electrode (9) and pad electrodes (10a—10c), the second electrode film being formed from a laminated metallic layer obtained by laminating a plurality of metallic films. The bottom layer (6a) of the second electrode film (6) is formed from one metal selected from the group consisting of AlCu alloy, NiCr alloy, AlSi alloy, AlTi alloy, titanium, and copper. The bottom layer (6a) of the second electrode film (6) is formed so as to reach the side surface of the second electrode film (6).
Inventors:
TSUDA MOTOJI (JP)
Application Number:
PCT/JP2011/065654
Publication Date:
May 18, 2012
Filing Date:
July 08, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
TSUDA MOTOJI (JP)
TSUDA MOTOJI (JP)
International Classes:
H03H9/145; H01L41/09; H01L41/18; H01L41/22; H01L41/29; H03H3/08
Foreign References:
| JP2003283282A | 2003-10-03 | |||
| JP2010252321A | 2010-11-04 | |||
| JPH0998043A | 1997-04-08 | |||
| JP2002026686A | 2002-01-25 | |||
| JP2005318017A | 2005-11-10 | |||
| JP2001168676A | 2001-06-22 | |||
| JP2006238327A | 2006-09-07 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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Claims: