Title:
ELECTRICAL CONTACT ENCAPSULATION
Document Type and Number:
WIPO Patent Application WO2006020345
Kind Code:
A3
Abstract:
An electronic device (500) comprises a substrate (510) and an electrical contact (520) in contact with the dielectric layer (544) and electrically coupled with at least one resistor (518), a substrate carrier (540) including an electrical trace (542) electrically coupled to the electrical contact (520), a polymer (524) enclosing the electrical contact (520), and a substantially planar film (528) disposed over the electrical contact (520).
Inventors:
BENSON BRAD (US)
BRETL FRANK J (US)
CHAPPELL ELLEN L (US)
IGELMAN M JEFFERY (US)
ZHANG STEVE H (US)
BRETL FRANK J (US)
CHAPPELL ELLEN L (US)
IGELMAN M JEFFERY (US)
ZHANG STEVE H (US)
Application Number:
PCT/US2005/025991
Publication Date:
October 26, 2006
Filing Date:
July 22, 2005
Export Citation:
Assignee:
HEWLETT PACKARD DEVELOPMENT CO (US)
BENSON BRAD (US)
BRETL FRANK J (US)
CHAPPELL ELLEN L (US)
IGELMAN M JEFFERY (US)
ZHANG STEVE H (US)
BENSON BRAD (US)
BRETL FRANK J (US)
CHAPPELL ELLEN L (US)
IGELMAN M JEFFERY (US)
ZHANG STEVE H (US)
International Classes:
B41J2/14
Foreign References:
| US5439849A | 1995-08-08 | |||
| US5083191A | 1992-01-21 | |||
| US6325491B1 | 2001-12-04 | |||
| US20030138991A1 | 2003-07-24 | |||
| US20030193545A1 | 2003-10-16 | |||
| US20020018102A1 | 2002-02-14 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 012, no. 150 (E - 606) 10 May 1988 (1988-05-10)
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