Title:
ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2022/024757
Kind Code:
A1
Abstract:
Provided is an electroconductive adhesive which is excellent in connection stability between adherends that are electroconductive members, which maintains the connection stability even when attached at high temperatures, and in which swelling toward the rear sides of the adherends hardly occurs. An electroconductive adhesive 1 contains: a binder component 12; and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170°C environment. The metal particles 11 preferably contain a metal having a melting point of 280°C or less. The content ratio of the metal having a melting point of 280℃ in the metal particles (A) 11 is preferably 80 mass% or greater.
Inventors:
HARUNA YUUSUKE (JP)
Application Number:
PCT/JP2021/026413
Publication Date:
February 03, 2022
Filing Date:
July 14, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J9/02; C09J11/04; C09J201/00; H05K3/32
Foreign References:
| JP2006298954A | 2006-11-02 | |||
| JP2009218443A | 2009-09-24 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
Download PDF: