Title:
ELECTRODE SUBSTRATE FILM AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/031802
Kind Code:
A1
Abstract:
[Problem] To provide an electrode substrate film that does not constitute a hindrance when processing a circuit pattern that comprises a thin line made of metal and in which the circuit pattern is hardly visible under high-luminance illumination, and a method for manufacturing the same. [Solution] The electrode substrate film having a transparent substrate 52 and a laminated thin line made of metal is characterized in that the laminated thin line has a metal absorption layer 51 of 20-30 nm in film thickness that is a first layer reckoning from the transparent substrate side and a metal layer 50 that is a second layer, the optical constants of the metal absorption layer in a visible wavelength region (400-780 nm) being such that the refractive index and extinction coefficient of a wavelength of 400 nm are 1.8-2.2 and 1.8-2.4 respectively, the refractive index and extinction coefficient of a wavelength of 500 nm are 2.2-2.7 and 1.9-2.8 respectively, the refractive index and extinction coefficient of a wavelength of 600 nm are 2.5-3.2 and 1.9-3.1 respectively, the refractive index and extinction coefficient of a wavelength of 700 nm are 2.7-3.6 and 1.7-3.3 respectively, and the refractive index and extinction coefficient of a wavelength of 780 nm are 3.1-3.8 and 1.5-3.4 respectively, the maximum reflectance of the visible wavelength region due to the interface reflection of the transparent substrate and metal absorption layer being 40% or less.
Inventors:
OKAMI HIDEHARU (JP)
Application Number:
PCT/JP2015/073801
Publication Date:
March 03, 2016
Filing Date:
August 25, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/041; B32B7/02; B32B15/08; C23C14/06; G06F3/044; H01B5/14; H01B13/00
Foreign References:
| JP2014513335A | 2014-05-29 |
Attorney, Agent or Firm:
UEDA, SHOZO (JP)
Ueda Shozo (JP)
Ueda Shozo (JP)
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