ELECTROLESS GOLD PLATING BATH

Title:

ELECTROLESS GOLD PLATING BATH

Document Type and Number:

WIPO Patent Application WO/1994/012686

Kind Code:

A1

Abstract:

An electroless gold plating bath comprising an aqueous solution of (a) chloroauric acid or a salt thereof, or a gold (I) complex salt of sulfurous or thiosulfuric acid as the gold source, (b) an alkali metal or ammonium salt of sulfurous or thiosulfuric acid, (c) ascorbic acid or a salt thereof, and (d) a pH buffer, said bath containing (e) a compound selected from among 2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole and salts thereof and further, if desired (f) an alkylamine compound. It can prevent precipitates from depositing when it is stored after the preparation or during the use thereof, can be used for long in a stable state, has a remarkably high plating rate, does not undergo any reduction in the plating rate even under a high bath load condition, can deal with a large amount of ojects being plated in a short time, and can give a thick coating in a short time.

Inventors:

KATO MASARU (JP)
YAZAMA YUTAKA (JP)
HOSHINO SHIGETAKA (JP)

Application Number:

PCT/JP1992/001538

Publication Date:

June 09, 1994

Filing Date:

November 25, 1992

Export Citation:

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Assignee:

KANTO KAGAKU (JP)
KATO MASARU (JP)
YAZAMA YUTAKA (JP)
HOSHINO SHIGETAKA (JP)

International Classes:

C23C18/44; (IPC1-7): C23C18/44

Foreign References:

JPS5192738A	1976-08-14
JPS5551027B2	1980-12-22
JPS61253376A	1986-11-11
JPS372955B1
JPS63137178A	1988-06-09
JPS5819468A	1983-02-04
JPS56108869A	1981-08-28
JPS6299477A	1987-05-08
JPH04350172A	1992-12-04
JPH01191782A	1989-08-01

Other References: