ELECTROLESS NICKEL PLATING BATH FOR FORMING ANISOTROPICALLY GROWN BUMP, METHOD FOR FORMING ANISOTROPICALLY GROWN BUMP, ARTICLE HAVING ANISOTROPICALLY GROWN BUMP FORMED THEREON AND ANISOTROPIC GROWTH ACCELERATOR FOR ELECTROLESS NICKEL PLATING BATH

Title:

Document Type and Number:

WIPO Patent Application WO/2004/057054

Kind Code:

A1

Abstract:

An electroless nickel plating bath for forming an anisotropically grown bump, characterized in that it comprises an anisotropic growth accelerator in an amount necessary to exhibit the effect to accelerate anisotropic growth; a method for forming an article having an anisotropically grown nickel bump; an article having an anisotropically grown nickel bump formed thereon; and an anisotropic growth accelerator for an electroless nickel plating bath. The electroless nickel plating bath allows the formation of bumps which have the form of a dome, have a high aspect ratio and are reduced in the variation in their heights, which bumps are required for corresponding with the tendency of broader range, more pins and a narrower pitch.

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Inventors:

SAIKI YUKINORI (JP)
NEMOTO KENICHI (JP)

Application Number:

PCT/JP2003/016404

Publication Date:

July 08, 2004

Filing Date:

December 19, 2003

Export Citation:

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Assignee:

JAPAN KANIGEN CO LTD (JP)
SAIKI YUKINORI (JP)
NEMOTO KENICHI (JP)

International Classes:

C23C18/32; H01L21/288; H01L21/60; (IPC1-7): C23C18/32; H01L21/60

Foreign References:

JP2002093835A	2002-03-29
US6413404B1	2002-07-02
JPH0582524A	1993-04-02

Other References:

TOKUZO KOBE: "NP Series Mudenkai Mekki", MAKISHOTEN, 30 September 1990 (1990-09-30), pages 5, 6, 21, 22, XP002979170

Attorney, Agent or Firm:

Kumakura, Yoshio (Shin-Tokyo Bldg. 3-1, Marunouchi 3-Chom, Chiyoda-Ku Tokyo, JP)

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