Title:
ELECTROLESS NICKEL STRIKE PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING FILM
Document Type and Number:
WIPO Patent Application WO/2019/004057
Kind Code:
A1
Abstract:
The purpose of the present invention is to address the problem of providing an electroless nickel plating solution capable of forming a nickel plating film which is capable of definitively covering the surface of a copper material even when the film is thin, and a method for forming the nickel plating film which uses the electroless nickel plating solution. In order to solve this problem, this electroless nickel strike plating solution to be used in order to form a nickel plating film on the surface of a copper material is characterized by containing: a water-soluble nickel salt in the amount of 0.002-1g/L by nickel content; one or more types of carboxylic acids or salts thereof; and one or more types of reducing agents selected from the group consisting of dimethylamine borane, trimethylamine borane, hydrazine, and a hydrazine derivative.
Inventors:
KATO TOMOHITO (JP)
WATANABE HIDETO (JP)
WATANABE HIDETO (JP)
Application Number:
PCT/JP2018/023631
Publication Date:
January 03, 2019
Filing Date:
June 21, 2018
Export Citation:
Assignee:
KOJIMA CHEMICALS CO LTD (JP)
International Classes:
C23C18/34; H01L21/28; H01L21/288; H01L21/3205; H01L21/768; H01L23/522; H01L23/532; H05K3/18
Foreign References:
| JP2016160504A | 2016-09-05 | |||
| JPH0598454A | 1993-04-20 | |||
| JP2008174774A | 2008-07-31 |
Other References:
See also references of EP 3650579A4
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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