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Title:
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
Document Type and Number:
WIPO Patent Application WO/2001/034879
Kind Code:
A1
Abstract:
An electrolytic copper foil with a carrier foil comprising a carrier foil layer, an organic jointing interface layer formed on the carrier foil layer and an electrolytic copper foil layer formed on the interface layer, characterized in that the difference in thermal expansion coefficient between the material of the carrier foil and the material of the electrolytic copper foil layer is 4 $m(x) 10?-7¿/deg. or more. The electrolytic copper foil with a carrier foil can be used for stabilizing the peeling strength for the carrier foil at a lower level and thus facilitating the work of peeling the carrier foil.

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Inventors:
TAENAKA SAKIKO (JP)
DOBASHI MAKOTO (JP)
SUGIMOTO AKIKO (JP)
TAKAHASHI NAOTOMI (JP)
Application Number:
PCT/JP2000/006765
Publication Date:
May 17, 2001
Filing Date:
September 29, 2000
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
TAENAKA SAKIKO (JP)
DOBASHI MAKOTO (JP)
SUGIMOTO AKIKO (JP)
TAKAHASHI NAOTOMI (JP)
International Classes:
C25D1/04; H05K3/02; H05K1/09; (IPC1-7): C25D1/04; H05K1/09
Foreign References:
JPS63274795A1988-11-11
JPH02113591A1990-04-25
JPH05102630A1993-04-23
JPH05218637A1993-08-27
JPH08197681A1996-08-06
EP0207244A21987-01-07
Other References:
See also references of EP 1152069A4
Attorney, Agent or Firm:
Tanaka, Daisuke (Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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