Title:
ELECTROMAGNETIC-WAVE-SHIELDING ADHESIVE FILM, PROCESS FOR PRODUCING THE SAME, AND METHOD OF SHIELDING ADHEREND FROM ELECTROMAGNETIC WAVE
Document Type and Number:
WIPO Patent Application WO/2006/088127
Kind Code:
A1
Abstract:
An electromagnetic-wave-shielding adhesive film which comprises a base film and a curable conductive adhesive layer (I), wherein the curable conductive adhesive layer (I) comprises: a polyurethane-polyurea resin (A) prepared by reacting a polyamino compound (e) with a urethane prepolymer (d) having an isocyanate group at an end and obtained by reacting a carboxylated diol compound (a), a polyol (b) which has a number-average molecular weight of 500-8,000 and is not a carboxylated diol compound, and an organic diisocyanate (c); an epoxy resin (B) having two or more epoxy groups; and a conductive filler.
Inventors:
KOBAYASHI HIDENOBU (JP)
NISHIYAMA YUJI (JP)
KUWABARA AKIFUMI (JP)
MATSUZAWA TAKAHIRO (JP)
UMEZAWA MITSUO (JP)
SAKAI SHOUHEI (JP)
NISHIYAMA YUJI (JP)
KUWABARA AKIFUMI (JP)
MATSUZAWA TAKAHIRO (JP)
UMEZAWA MITSUO (JP)
SAKAI SHOUHEI (JP)
Application Number:
PCT/JP2006/302825
Publication Date:
August 24, 2006
Filing Date:
February 17, 2006
Export Citation:
Assignee:
TOYO INK MFG CO (JP)
KOBAYASHI HIDENOBU (JP)
NISHIYAMA YUJI (JP)
KUWABARA AKIFUMI (JP)
MATSUZAWA TAKAHIRO (JP)
UMEZAWA MITSUO (JP)
SAKAI SHOUHEI (JP)
KOBAYASHI HIDENOBU (JP)
NISHIYAMA YUJI (JP)
KUWABARA AKIFUMI (JP)
MATSUZAWA TAKAHIRO (JP)
UMEZAWA MITSUO (JP)
SAKAI SHOUHEI (JP)
International Classes:
H05K9/00; B32B27/00; C08L63/00; C08L75/04; C09J7/35; C09J9/02; C09J163/00; C09J175/04
Foreign References:
| JP2004273577A | 2004-09-30 | |||
| JP2001036277A | 2001-02-09 | |||
| JPH07122883A | 1995-05-12 | |||
| JP2002226821A | 2002-08-14 | |||
| JP2004300223A | 2004-10-28 |
Attorney, Agent or Firm:
Morita, Kenichi (Itabashi-chuo Bldg. 67-8, Itabashi 2-chom, Itabashi-ku Tokyo04, JP)
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