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Title:
ELECTROMAGNETICALLY SHIELDED CIRCUIT DEVICE AND SHIELDING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2003/092347
Kind Code:
A1
Abstract:
A method for electromagnetically shielding a circuit device comprises a step of feeding a circuit board mounted with electronic components and having a ground connecting section, a step of inserting the whole of the circuit board into a baglike shield pack having insulation layer as the innermost layer and a conductive layer as the outermost layer, and a step of bringing the insulation layer of the shield pack into close contact with the electronic components and the circuit board. These steps are utilized to connect the ground connecting section of the circuit board with the conductive layer of the shield pack.

Inventors:
OGATSU TOSHINOBU (JP)
Application Number:
PCT/JP2003/005136
Publication Date:
November 06, 2003
Filing Date:
April 23, 2003
Export Citation:
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Assignee:
NEC CORP (JP)
OGATSU TOSHINOBU (JP)
International Classes:
H05K3/28; H05K9/00; H05K1/02; (IPC1-7): H05K9/00; H05K3/28
Domestic Patent References:
WO1994018815A11994-08-18
WO1995028072A11995-10-19
WO1995028822A11995-10-26
Foreign References:
EP0802710A21997-10-22
GB2254193A1992-09-30
JPH0951192A1997-02-18
JP2001284779A2001-10-12
US5394304A1995-02-28
JPS60241237A1985-11-30
EP0659041A11995-06-21
JPS5956745A1984-04-02
US5166864A1992-11-24
US4858075A1989-08-15
US5005106A1991-04-02
US20020129951A12002-09-19
JPH0951192A1997-02-18
EP0781085A11997-06-25
EP0802710A21997-10-22
GB2254193A1992-09-30
Other References:
See also references of EP 1499172A4
Attorney, Agent or Firm:
Kudoh, Minoru (6F 24-10, Minamiooi 6-chom, Shinagawa-ku Tokyo, JP)
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