Title:
ELECTRONIC COMPONENT, BULK CASE, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/116677
Kind Code:
A1
Abstract:
This electronic component (10), which has a rectangular parallelepiped shape, and of which the dimension of the longest side is no more than 0.63 mm, is provided with, on one surface among the surfaces thereof, an identification mark (20) which has a function for identifying a lot of an electronic component (10) and a function for identifying the mounting direction of the electronic component (10).
Inventors:
MIYAMOTO MASAYUKI (JP)
Application Number:
PCT/JP2023/038782
Publication Date:
June 06, 2024
Filing Date:
October 26, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/00; H01F27/29; H01F27/30
Domestic Patent References:
| WO2022219744A1 | 2022-10-20 | |||
| WO2014045664A1 | 2014-03-27 |
Foreign References:
| JP2019067953A | 2019-04-25 | |||
| JPH11297533A | 1999-10-29 | |||
| JPH0997012A | 1997-04-08 | |||
| JP2007242806A | 2007-09-20 | |||
| JP2009295618A | 2009-12-17 | |||
| JP2008066404A | 2008-03-21 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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