Title:
ELECTRONIC COMPONENT AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2006/100746
Kind Code:
A1
Abstract:
A plurality of solder bumps (101-103) formed as electrically connecting terminals on an electronic component (100) are permitted to abut to a plurality of spiral contactors (151-153) formed as electrical contactors on a circuit board (150) whereupon the electronic component (100) is to be mounted, and the solder bumps and the spiral contactors are electrically connected. The solder bumps (101-103) of the electronic component (100) are formed to have different heights to a main plane (116) whereupon the solder bumps (101-103) of the electronic component (100) are formed.
Inventors:
MATSUI JUN (JP)
TERADA KOJI (JP)
NOBUHARA HIROYUKI (JP)
TERADA KOJI (JP)
NOBUHARA HIROYUKI (JP)
Application Number:
PCT/JP2005/005030
Publication Date:
September 28, 2006
Filing Date:
March 18, 2005
Export Citation:
Assignee:
FUJITSU LTD (JP)
MATSUI JUN (JP)
TERADA KOJI (JP)
NOBUHARA HIROYUKI (JP)
MATSUI JUN (JP)
TERADA KOJI (JP)
NOBUHARA HIROYUKI (JP)
International Classes:
H01R33/76; H05K3/34
Foreign References:
| JPH1140713A | 1999-02-12 | |||
| JP2004327182A | 2004-11-18 | |||
| JP2002175859A | 2002-06-21 | |||
| JP2004234872A | 2004-08-19 | |||
| JP2002005992A | 2002-01-09 |
Attorney, Agent or Firm:
Sakai, Akinori (19F Kasumigaseki Building, 2-5, Kasumigaseki 3-chom, Chiyoda-ku Tokyo, JP)
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