Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO2005101943
Kind Code:
A3
Abstract:
In an electronic component mounting process for mounting electronic components (6) to a substrate (13), each of the electronic components (6) having an adhesive layer on a surface to be bonded to the substrate (13) is picked up with suction nozzle (33a) provided with individual heater (49), and a time taken for the mounting operation is so allotted that a first heating time (T1) of a duration from a moment when the suction nozzle (33a) comes into contact with the electronic component (6) for picking it up till another moment immediately before it begins a mounting motion to the substrate (13) is longer than a second heating time (T2) of a duration from the moment when the suction nozzle (33a) begins the mounting motion till another moment when it leaves the electronic component (6) mounted to the substrate (13).
Inventors:
HAJI HIROSHI
OZONO MITSURU
OZONO MITSURU
Application Number:
PCT/JP2005/007276
Publication Date:
January 12, 2006
Filing Date:
April 08, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
HAJI HIROSHI
OZONO MITSURU
HAJI HIROSHI
OZONO MITSURU
International Classes:
H01L21/52; H01L21/00; H01L21/68; H01L21/683; H05K13/00; (IPC1-7): H05K13/04
Foreign References:
| US5172469A | 1992-12-22 | |||
| EP0487315A2 | 1992-05-27 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 24 11 May 2001 (2001-05-11)
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 09 30 July 1999 (1999-07-30)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 24 11 May 2001 (2001-05-11)
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 09 30 July 1999 (1999-07-30)
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