Title:
ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/095447
Kind Code:
A1
Abstract:
An electronic component package 1 is provided with an electronic component 10 and a sealing resin 20 that seals the periphery of the electronic component 10. With respect to this electronic component package 1, one main surface of the sealing resin 20 forms a mounting surface 21 that mounts the electronic component package 1 on another substrate; and when the sealing resin 20 is viewed from the mounting surface 21 side, both a land 30 and a conductor part 40 are exposed in the mounting surface 21, the land 30 being electrically connected to an electrode 15 of the electronic component 10, and the conductor part 40 being formed of a solder or an alloy phase of a solder and another metal, while being provided so as to surround at least a part of the outer periphery of the land 30.
Inventors:
YOSHIMORI HIROKI (JP)
TAKAKURA TSUYOSHI (JP)
KINO DAISUKE (JP)
NAKAGOSHI HIDEO (JP)
NAKAMURA TAKAMITSU (JP)
TAKAKURA TSUYOSHI (JP)
KINO DAISUKE (JP)
NAKAGOSHI HIDEO (JP)
NAKAMURA TAKAMITSU (JP)
Application Number:
PCT/JP2022/036906
Publication Date:
June 01, 2023
Filing Date:
October 03, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L21/56; H01L23/28
Domestic Patent References:
| WO2012137714A1 | 2012-10-11 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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