Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/136258
Kind Code:
A1
Abstract:
Provided is an electronic component with which high reliability during application of voltage can be obtained. An electronic component 1 comprises a laminate 2 in which dielectric layers 11, each having a thickness of 0.8-4.1 μm, and inner electrode layers 12, each having a thickness of 0.5-1.2 μm, are alternately laminated, and each of the number of the dielectric layers 11 and the number of the inner electrode layers 12 is 200-650 inclusive. In the electronic component, solid-solution layers 20 in which a first metal component, which is the main component of the inner electrode layers 12, has a second metal component, which is different from and the first metal component, mixed therein to form a solid solution, and are provided at the interfaces between the inner electrode layers 12 and the dielectric layers 11. The solid-solution layers 20 include: center solid-solution layers 21 located at least 10 μm inward from widthwise ends and longitudinal ends, at facing portions 12a that are of the inner electrode layers 12 adjacent to each other and that face each other; and outer solid-solution layers 22 surrounding the center solid-solution layers 21. The proportion of the second metal component to the first metal component in the form of the solid solution is larger in the center solid-solution layers 21 than in the outer solid-solution layers 22.
Inventors:
YAMAGUCHI SHINICHI (JP)
SUZUKI SHOICHIRO (JP)
SUZUKI SHOICHIRO (JP)
Application Number:
PCT/JP2023/000416
Publication Date:
July 20, 2023
Filing Date:
January 11, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Foreign References:
| JP2021108360A | 2021-07-29 | |||
| JP2021034648A | 2021-03-01 | |||
| JP2020031202A | 2020-02-27 |
Attorney, Agent or Firm:
KATO Ryuta et al. (JP)
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