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Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/101032
Kind Code:
A1
Abstract:
[Problem] To increase the utilization efficiency of a conductor layer in an electronic component having a structure in which the following are alternatingly stacked: a conductor layer including an inductor; and a resin layer. [Solution] An electronic component 1 includes alternatingly stacked conductor layers M1-M4 and resin layers 21-23. The conductor layer M2 includes a conductor pattern 63, and the conductor layer M3 includes a conductor pattern 80. The conductor pattern 63 includes a support section 63A overlapping with a terminal electrode 13, and coil sections 63B, 63C connected to the support section 63A without overlapping with the terminal electrode 13. The conductor pattern 80 includes: a support section 83A overlapping with the terminal electrode 13 and connected to the terminal electrode 13 by a via 93 provided in the resin layer 23; and a coil section 83B connected to the support potion 83A without overlapping with the terminal electrode 13. The coil sections 63B, 63C are connected by the support section 63A, and the entire surface of the support section 63A is covered by the resin layer 22.

Inventors:
TANAKA MASAMICHI (JP)
Application Number:
PCT/JP2023/035888
Publication Date:
May 16, 2024
Filing Date:
October 02, 2023
Export Citation:
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Assignee:
TDK CORP (JP)
International Classes:
H01F27/29; H01F17/00; H01F27/00; H01F27/28; H01G4/40
Domestic Patent References:
WO2015005161A12015-01-15
Foreign References:
JP2021106223A2021-07-26
JP2022055128A2022-04-07
JP2000173835A2000-06-23
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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