Title:
ELECTRONIC DEVICE COMPRISING ANTENNA MODULE
Document Type and Number:
WIPO Patent Application WO/2024/135891
Kind Code:
A1
Abstract:
This antenna module comprises: a printed circuit board (PCB) implemented as a multilayer substrate formed by a plurality of dielectric layers; a feed pattern formed in a first layer of the multilayer substrate; a ground connection pattern formed in the first layer of the multilayer substrate; and a conductive pattern connected to the feed pattern and the ground connection pattern. The feed pattern includes a first sub pattern and a second sub pattern, and the ground connection pattern includes a third sub pattern and a fourth sub pattern. The distance between a first connection point between the first sub pattern and the second sub pattern and a second connection point between the third sub pattern and the fourth sub pattern may be formed to be different from the length of the conductive pattern.
Inventors:
WOO, Seungmin (LG Electronics Inc.,19, Yangjae-daero 11-gil,,Seocho-gu, Seoul, KR)
SUH, Yusuhk (LG Electronics Inc.,19, Yangjae-daero 11-gil,,Seocho-gu, Seoul, KR)
LEE, Dongik (LG Electronics Inc.,19, Yangjae-daero 11-gil,,Seocho-gu, Seoul, KR)
SUH, Yusuhk (LG Electronics Inc.,19, Yangjae-daero 11-gil,,Seocho-gu, Seoul, KR)
LEE, Dongik (LG Electronics Inc.,19, Yangjae-daero 11-gil,,Seocho-gu, Seoul, KR)
Application Number:
PCT/KR2022/021095
Publication Date:
June 27, 2024
Filing Date:
December 22, 2022
Export Citation:
Assignee:
LG ELECTRONICS INC. (Yeongdeungpo-gu, Seoul, KR)
International Classes:
H01Q1/38; H01Q1/24; H01Q1/46; H01Q21/06
Attorney, Agent or Firm:
PARK, Jang-Won (566, Gangnam-daero,Gangnam-Gu, Seoul, KR)
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