Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/149637
Kind Code:
A1
Abstract:
Provided is an electronic device that can suppress a bonding material from peeling or being damaged. The electronic device comprises an electronic component, a mounting part, and a bonding material. The electronic component has an element main surface and an element rear surface that are separated from each other in the z direction. The mounting part has a mounting surface facing the element rear surface, and the electronic component is mounted on the mounting part. The bonding material bonds the electronic component to the mounting part. The bonding material includes a base portion and a fillet portion. The base portion is sandwiched between the electronic component and the mounting part in the z direction. The fillet portion is connected to the base portion and is formed outside the electronic component when viewed in the z direction. The electronic component includes two element side surfaces and a ridge. The ridge is an intersection of the two element side surfaces and extends in the z direction. The fillet portion includes a ridge covering portion that covers at least a portion of the ridge.
Inventors:
FUTAMURA YOSUI (JP)
NAKAMURA MASAHIKO (JP)
NAKAMURA MASAHIKO (JP)
Application Number:
PCT/JP2021/001480
Publication Date:
July 29, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/12; H01L21/52
Foreign References:
| JP2005516399A | 2005-06-02 | |||
| JP2019029662A | 2019-02-21 | |||
| US20180040530A1 | 2018-02-08 | |||
| JP2014130961A | 2014-07-10 | |||
| JP2010245161A | 2010-10-28 | |||
| JPH08330487A | 1996-12-13 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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