Title:
ELECTRONIC DEVICE PROTECTION STRUCTURE, CIRCUIT BOARD, DISPLAY MODULE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/226644
Kind Code:
A1
Abstract:
Disclosed in the present disclosure are an electronic device protection structure, a circuit board, a display module and a manufacturing method, which are used to solve the problems of poor electromagnetic and electrostatic protection effects due to wrinkles and pseudo sticking of an adhesive tape when same is stuck to an electronic device using a related technique. The circuit board comprises: a substrate, a component group located on one side of the substrate, a first protective adhesive tape located on the side of the component group away from the substrate, and a second protective adhesive tape located on the side of the first protective adhesive tape away from the component group, wherein the first protective adhesive tape comprises a covering portion covering the component group, and a bonding portion extending from at least one side of the covering portion until the bonding portion comes into contact with the substrate; and the second protective adhesive tape is attached to the periphery of the component group, and is electrically bonded to the bonding portion.
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Inventors:
CAI YANGYANG (CN)
ZHANG YING (CN)
XIE ZHIHAO (CN)
LIANG HENGZHEN (CN)
ZHANG YING (CN)
XIE ZHIHAO (CN)
LIANG HENGZHEN (CN)
Application Number:
PCT/CN2023/089684
Publication Date:
November 30, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H05K5/02
Foreign References:
| CN101765289A | 2010-06-30 | |||
| CN214122615U | 2021-09-03 | |||
| CN216487054U | 2022-05-10 | |||
| US20170358642A1 | 2017-12-14 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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