Title:
ELECTRONICS COMPONENT AND METHOD FOR FABRICATING SAME
Document Type and Number:
WIPO Patent Application WO2004028223
Kind Code:
A3
Abstract:
An electronic component (20) for mounting on a mating component is provided. The electronic component (20) includes a case (22) and a plurality of electrical contacts (26). The case (22) is fabricated from an electrically insulative material, such as a liquid crystal polymer material, and is sized and shaped to support or house an electronic device. The case includes at least one engagement surface (27) sized and shaped for engaging a mating component and the electrical contacts included an electrically conductive layer (30) deposited on the engagement surface.
Inventors:
LINDSEY RAYMOND A
Application Number:
PCT/US2003/029391
Publication Date:
December 22, 2005
Filing Date:
September 17, 2003
Export Citation:
Assignee:
KVP TECHNOLOGIES INC (US)
International Classes:
H05K3/30; H01F27/02; H01F27/29; H05K3/34; (IPC1-7): H01F27/29; H01F7/06; H01F27/02
Foreign References:
| US6297721B1 | 2001-10-02 | |||
| US5650920A | 1997-07-22 |
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