Title:
ELECTROSTATIC CHUCK DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/148126
Kind Code:
A1
Abstract:
An electrostatic chuck device, relating to the technical field of semiconductor wafer processing. The electrostatic chuck device comprises: a first insulation layer (4), a second insulation layer (6), an electrode layer (5), and a metal layer (7), wherein the first insulation layer (4) is provided above the second insulation layer (6); the electrode layer (5) is provided between the first insulation layer (4) and the second insulation layer (6); the second insulation layer (6) is provided on the metal layer (7); and the first insulation layer (4) is made of a sapphire material. The electrostatic chuck device improves the surface plasma ablation resisting capability, and overcomes the difficulty of sintering a ceramic layer of the conventional electrostatic chunk under high temperature.
Inventors:
ZHU YU (CN)
XU DENGFENG (CN)
XU YAN (CN)
YANG PENGYUAN (CN)
MU HAIHUA (CN)
CHENG RONG (CN)
TANG NANA (CN)
HAN WEIQI (CN)
ZHANG MING (CN)
YANG KAIMING (CN)
XU DENGFENG (CN)
XU YAN (CN)
YANG PENGYUAN (CN)
MU HAIHUA (CN)
CHENG RONG (CN)
TANG NANA (CN)
HAN WEIQI (CN)
ZHANG MING (CN)
YANG KAIMING (CN)
Application Number:
PCT/CN2016/098250
Publication Date:
September 08, 2017
Filing Date:
September 06, 2016
Export Citation:
Assignee:
BEIJING U-PRECISION TECH CO LTD (CN)
International Classes:
H01L21/683
Foreign References:
| US5413360A | 1995-05-09 | |||
| CN1777987A | 2006-05-24 | |||
| US8987639B2 | 2015-03-24 | |||
| CN205406504U | 2016-07-27 | |||
| CN205406505U | 2016-07-27 | |||
| CN101405857A | 2009-04-08 |
Attorney, Agent or Firm:
BEIJING ENHO LAW FIRM (CN)
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