Title:
EMBEDDED CIRCUIT BOARD PATCH STRUCTURE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/179753
Kind Code:
A1
Abstract:
An embedded circuit board patch structure comprises a circuit board main body (20) as a carrier, and an electronic device (10) connected to the circuit board main body (20). The embedded circuit board patch structure is characterized in that: the circuit board main body (20) has an accommodating space for accommodating a vertical thickness or a partial vertical thickness of the electronic device (10), and is provided with a main body solder pad (40). An upper surface of the electronic device (10) is provided with a device solder pad (30), and the main body solder pad (40) and the device solder pad (30) are conducted via a conductive material (50). After the electronic device (10) is placed in the preset accommodating space, an exposed thickness of the electronic device (10) is greatly reduced; namely, the space is saved by utilizing the thickness of the circuit board main body (20), such that an integrated thickness of the circuit board (20) and the electronic device (10) carried on the circuit board is reduced to the greatest extent, and the upper surface of the electronic device (10) can even be level with a surface of the circuit board (20) to achieve zero added thickness, thus bringing a preferable solution for further achieving an ultra-thin circuit board.
Inventors:
FANG LIWEN (CN)
LIN ZILIANG (CN)
LIN ZILIANG (CN)
Application Number:
PCT/CN2015/078582
Publication Date:
November 17, 2016
Filing Date:
May 08, 2015
Export Citation:
Assignee:
FANG LIWEN (CN)
LIN ZILIANG (CN)
LIN ZILIANG (CN)
International Classes:
H01L23/13; H01L21/52
Foreign References:
| US5696666A | 1997-12-09 | |||
| US6518501B1 | 2003-02-11 | |||
| CN101165866A | 2008-04-23 | |||
| EP2287903A2 | 2011-02-23 |
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