Title:
EPOXY COMPOUND PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/095928
Kind Code:
A1
Abstract:
The present invention provides an epoxy compound product which has a low viscosity and is not susceptible to curing shrinkage, while being capable of forming a cured product that exhibits excellent heat resistance and excellent transparency. With respect to an epoxy compound product according to the present disclosure, the purity of a compound represented by formula (1) is 90% or higher, and the total content of a compound represented by formula (a), a compound represented by formula (b), a compound represented by formula (c), and a compound represented by formula (d) is 10% by mass or less.
Inventors:
OKA MARIKO (JP)
TAKENAKA HIROTO (JP)
SUZUKI HIROSE (JP)
TAKENAKA HIROTO (JP)
SUZUKI HIROSE (JP)
Application Number:
PCT/JP2023/038956
Publication Date:
May 10, 2024
Filing Date:
October 27, 2023
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08G59/24; C07D303/44; C09D7/63; C09D163/00; C09J11/06; C09J163/00
Domestic Patent References:
| WO2019138988A1 | 2019-07-18 | |||
| WO2006073093A1 | 2006-07-13 | |||
| WO2005090325A1 | 2005-09-29 | |||
| WO2020213526A1 | 2020-10-22 |
Foreign References:
| US2999827A | 1961-09-12 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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