EXPANSION METHOD AND DEVICE

WIPO Patent Application WO/2004/038779

A1

After a plate-like article (W) is subjected to a dicing process, an adhesive sheet (S) is expanded by expansion means (20) with the plate-like article (W) being mounted on a frame (F). As a result, the spacings between individual chips (T) are increased. The adhesive sheet (S) is maintained in the expanded state by expansion-maintaining means (10). The plate-like article (W), together with the frame (F), is thus made to be transportable with the spacings between the chips (T) being maintained, and therefore adjacent ones of the chips (T) are prevented from interfering with each other. The plate-like article (W) after a dicing process can be transported with the frame (F) without edge portions of adjacent ones of the chips (T) having breaks, micro-cracks, etc. resulted from contact between the edge portions caused by vibration during transportation.

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KUBO YUICHI (JP)
OSADA MASATERU (JP)
AZUMA MASAYUKI (JP)
SAKAYA YASUYUKI (JP)
ARAI YUUSUKE (JP)
TAMAKI TOMOHIRO (JP)

PCT/JP2003/013711

May 06, 2004

October 27, 2003

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TOKYO SEIMITSU CO LTD (JP)
KUBO YUICHI (JP)
OSADA MASATERU (JP)
AZUMA MASAYUKI (JP)
SAKAYA YASUYUKI (JP)
ARAI YUUSUKE (JP)
TAMAKI TOMOHIRO (JP)

H01L21/00; H01L21/301; H01L21/68; (IPC1-7): H01L21/301; H01L21/52; H01L21/68

US6344402B1	2002-02-05
JPH04255243A	1992-09-10
JP2003051465A	2003-02-21
JPS5956742U	1984-04-13
US4744550A	1988-05-17

Matsuura, Kenzo (P.O. Box 176 Shinjuku Sumitomo Bldg. 20F, 6-1, Nishi-shinjuku 2-chom, Shinjuku-ku Tokyo, JP)

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