Title:
EXPOSURE METHOD AND APPARATUS, AND DEVICE PRODUCING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/067012
Kind Code:
A1
Abstract:
An exposure method for transferring a pattern on a mask onto a substrate by using a reflecting-refracting projection system having partial barrels for holding optical systems with optical axes extending in different directions. The amount of rotation of the reflecting-refracting projection system about the optical axis intersecting at least either the mask or the substrate is measured, and based on the measurement result, either the attitude of or a scan direction of either the mask or the substrate is adjusted. Since the substrate is exposed by adjusting either the attitude of or a scan direction of either the mask or the substrate so as to cancel rotation of a projected image on the substrate caused by the rotation of the projection optical system, excellent exposure accuracy can be obtained.
Inventors:
MIZUTANI TAKEYUKI (JP)
Application Number:
PCT/JP2004/019204
Publication Date:
July 21, 2005
Filing Date:
December 22, 2004
Export Citation:
Assignee:
NIKON CORP (JP)
MIZUTANI TAKEYUKI (JP)
MIZUTANI TAKEYUKI (JP)
International Classes:
G03F7/20; H01L21/027; (IPC1-7): H01L21/027; G03F7/20
Domestic Patent References:
WO1999045580A1 | 1999-09-10 |
Foreign References:
JP2003309053A | 2003-10-31 | |||
JP2001215718A | 2001-08-10 | |||
JP2000003851A | 2000-01-07 | |||
JPH07218863A | 1995-08-18 |
Other References:
See also references of EP 1705694A4
Attorney, Agent or Firm:
Shiga, Masatake (Yaesu Chuo-k, Tokyo 53, JP)
Download PDF:
Previous Patent: EXTREME ULTRAVIOLET MASK WITH MOLYBDENUM PHASE SHIFTER
Next Patent: FILM FORMING DEVICE AND FILM FORMING METHOD
Next Patent: FILM FORMING DEVICE AND FILM FORMING METHOD