Title:
FILM DEPOSITION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/187503
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a film deposition device whose cost is kept to a minimum and that inhibits phenomena in which warpage or cracking occurs in the film deposition substrate. In this film deposition device, a suction gripper (4A), which performs an operation (M5) for placing a substrate on a substrate loading stage (3), and a suction gripper (4B), which performs an operation (M6) for retrieving a substrate from the substrate loading stage (3), have heating mechanisms (42A and 42B). Consequently, first and second preheating treatments for heating substrates (10) via the heating mechanisms (42A and 42B) can be performed even when the suction grippers (4A and 4B) are each gripping the substrates (10).
Inventors:
ORITA HIROYUKI (JP)
HIRAMATSU TAKAHIRO (JP)
HIRAMATSU TAKAHIRO (JP)
Application Number:
PCT/JP2016/063018
Publication Date:
November 02, 2017
Filing Date:
April 26, 2016
Export Citation:
Assignee:
TOSHIBA MITSUBISHI-ELECTRIC IND SYSTEMS CORP (JP)
International Classes:
C23C14/50; C23C16/02; C23C16/44; H01L21/677
Foreign References:
| JPS63166217A | 1988-07-09 | |||
| JP2010109089A | 2010-05-13 | |||
| JPH07142408A | 1995-06-02 | |||
| JP2012151312A | 2012-08-09 | |||
| JP2003133261A | 2003-05-09 | |||
| JP2014072352A | 2014-04-21 | |||
| JP2000114343A | 2000-04-21 | |||
| JP2012219357A | 2012-11-12 | |||
| JP2003158174A | 2003-05-30 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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