Title:
FILM FORMING DEVICE, METHOD FOR OPERATING FILM FORMING DEVICE, AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/053192
Kind Code:
A1
Abstract:
The present invention is characterized by comprising: an electrostatic chuck 31 which grabs, by suction, a surface on the opposite side to a film forming-side surface of a substrate S; a substrate support member 41 which supports a peripheral edge of the substrate S at least at a time point before the substrate S is grabbed by the electrostatic chuck 31; and a mask stand 54 which supports a mask M disposed on the film forming side of the substrate S, wherein while the substrate S supported by the substrate support member 41 is brought into contact with the mask M supported by the mask stand 54, a grabbing force for grabbing, by suction, the substrate S by means of the electrostatic chuck 31 is generated.
Inventors:
ISHII HIROSHI (JP)
Application Number:
PCT/JP2023/021329
Publication Date:
March 14, 2024
Filing Date:
June 08, 2023
Export Citation:
Assignee:
CANON TOKKI CORP (JP)
International Classes:
C23C14/50; H01L21/683
Foreign References:
| JP2006233259A | 2006-09-07 | |||
| JP2022057675A | 2022-04-11 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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