Title:
FILM STATE MEASUREMENT METHOD, FILM STATE MEASUREMENT DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2024/101321
Kind Code:
A1
Abstract:
In this film state measurement method for measuring the state of a film between a first member and a second member lubricated by a lubricating agent, impedance is measured by applying a prescribed voltage to the first member and the second member, the impedance of each of a plurality of layers formed between the first member and the second member is derived by performing fitting of the measured impedance on the basis of equivalent circuits corresponding to each of the plurality of layers between the first member and the second member; and the state of a film between the first member and the second member is measured on the basis of the derived impedances.
Inventors:
KOSUGI DAICHI (JP)
IWASE SHUNSUKE (JP)
AIKAWA FUMIAKI (JP)
MARUYAMA TAISUKE (JP)
IWASE SHUNSUKE (JP)
AIKAWA FUMIAKI (JP)
MARUYAMA TAISUKE (JP)
Application Number:
PCT/JP2023/039929
Publication Date:
May 16, 2024
Filing Date:
November 06, 2023
Export Citation:
Assignee:
NSK LTD (JP)
International Classes:
G01M13/04; G01N27/02; G01N27/04; G01N27/22
Domestic Patent References:
| WO2022071164A1 | 2022-04-07 |
Foreign References:
| JP2009257460A | 2009-11-05 | |||
| JP2009527211A | 2009-07-23 | |||
| JPS59210353A | 1984-11-29 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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