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Title:
FILM FOR THERMAL COMPRESSION BONDING, WHICH CONTAINS CHOLESTERIC LIQUID CRYSTAL LAYER, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/050256
Kind Code:
A1
Abstract:
The present invention provides a film for thermal compression bonding, which contains a cholesteric liquid crystal layer that is formed by curing a liquid crystal composition containing a polymerizable calamitic liquid crystal compound, a chiral agent and a polymerizable monomer. The polymerizable calamitic liquid crystal compound contains: a monofunctional calamitic liquid crystal compound having one polymerizable group and a bifunctional calamitic liquid crystal compound having two polymerizable groups; or two or more bifunctional calamitic liquid crystal compounds, each having two polymerizable groups. The polymerizable monomer has three or more polymerizable groups, and the polymerizable monomer is contained in an amount of 0.3-6.0% by mass relative to the total mass of the polymerizable calamitic liquid crystal compounds. The present invention also provides: a method for producing a molded article using this film for thermal compression bonding; and a molded article which is produced by this production method.

Inventors:
TAGUCHI TAKAO (JP)
OKI KAZUHIRO (JP)
Application Number:
PCT/JP2014/076613
Publication Date:
April 09, 2015
Filing Date:
October 03, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B5/30; B29C43/18; B29C45/14; B32B27/00; C08F2/44
Domestic Patent References:
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Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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