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Title:
FLOOR STRUCTURE AND USE OF SAME
Document Type and Number:
WIPO Patent Application WO/2018/235620
Kind Code:
A1
Abstract:
Provided is a floor structure that uses a tile backing exhibiting excellent vibration damping ability while decreasing construction time and cost. A floor structure comprises, in order from the bottom, an adhesion layer, a buffer material, an elastic adhesion layer, and a plurality of tiles. The buffer material is a foam polyolefin plate with a thickness of 7 mm to 25 mm and a density of 20 kg/m3 to 100 kg/m3. The tile area is 80 cm2 to 900 cm2, inclusive. Joints between the plurality of tiles are filled with an elastic joint material.

More Like This:
JPH04203160FLOOR MATERIAL WITH NON-SLIP FUNCTION
JPS53135131FLOOR MATERIAL
Inventors:
MATSUYOSHI HIROKI (JP)
Application Number:
PCT/JP2018/021874
Publication Date:
December 27, 2018
Filing Date:
June 07, 2018
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
E04F15/18; E04B1/86; E04F15/20
Foreign References:
JPS5632747U1981-03-31
JPS63500088A1988-01-14
JP2002309766A2002-10-23
JP2004360255A2004-12-24
JP2000120257A2000-04-25
JPH11148185A1999-06-02
JPS60500580A1985-04-25
JPS63289166A1988-11-25
US20140099487A12014-04-10
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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