FOAMABLE RESIN COMPOSITION AND FOAM MOLDED BODY

Title:

FOAMABLE RESIN COMPOSITION AND FOAM MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2012/032991

Kind Code:

A1

Abstract:

The object of the present invention is to provide a foamable resin composition capable of foam molding with a high foaming ratio and reducing interconnected cells. The object of the present invention is also to provide a foam molded body produced by using the foamable resin composition. The present invention is a foamable resin composition comprising a thermoplastic resin, a thermally expandable microcapsule, and a chemical foaming agent, wherein when the foaming starting temperature of the thermally expandable microcapsule is Ts, the maximum foaming temperature is Tmax, and the decomposition temperature of the chemical foaming agent is Tc, Ts is 120°C or more, Tmax is 190°C or more, and Ts-Tc is between -30°C and 6°C.

Inventors:

YAMAUCHI HIROSHI (JP)
MORITA HIROYUKI (JP)
NATSUI HIROSHI (JP)

Application Number:

PCT/JP2011/069868

Publication Date:

March 15, 2012

Filing Date:

September 01, 2011

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)
YAMAUCHI HIROSHI (JP)
MORITA HIROYUKI (JP)
NATSUI HIROSHI (JP)

International Classes:

C08J9/32; C08J9/06

Foreign References:

JP2009221429A	2009-10-01
JP2005271499A	2005-10-06
JP2007246578A	2007-09-27
JPS5842212B2	1983-09-17
JPS5842209B2	1983-09-17
JP2000178372A	2000-06-27
JP2000017103A	2000-01-18
JP2005212377A	2005-08-11

Other References: