Title:
GROUND MEMBER, SHIELDED PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SHIELDED PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/147429
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a ground member which can be positioned as desired, and which, when using repeated heating and cooling to mount components onto a shielded printed circuit board using the ground member, is less susceptible to deviations occurring between a conductive filler of the ground member and a shield layer of a shield film. This ground member comprises: an external connection member which has a first main surface and a second main surface opposite to the first main surface, and which is conductive; a conductive filler which is positioned on the first main surface side; and an adhesive resin which fixes the conductive filler to the first main surface. The ground member is characterized in that the conductive filler includes a metal having a low melting point.
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Inventors:
HARUNA YUUSUKE (JP)
KATSUKI TAKAHIKO (JP)
HASEGAWA TSUYOSHI (JP)
TAJIMA HIROSHI (JP)
KATSUKI TAKAHIKO (JP)
HASEGAWA TSUYOSHI (JP)
TAJIMA HIROSHI (JP)
Application Number:
PCT/JP2018/004683
Publication Date:
August 16, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K1/02; H05K9/00
Foreign References:
| JP4201548B2 | 2008-12-24 | |||
| JPH03257769A | 1991-11-18 | |||
| JP2002111154A | 2002-04-12 | |||
| JP2016029748A | 2016-03-03 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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