Title:
HEAD MOUNTED DEVICE SUPPORTING MOBILE PAYMENT, OPERATION METHOD THEREOF, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/106901
Kind Code:
A1
Abstract:
A head mounted device according to an embodiment may comprise: a first camera; a sensor circuit which acquires authentication data; a first communication interface; and at least one first processor which is operatively connected to the first camera, the sensor circuit, and the first communication interface. The at least one first processor may be configured to acquire payment-related data on the basis of an image or video acquired through the first camera. The at least one first processor may be configured to acquire the authentication data through the sensor circuit on the basis of the acquired payment-related data. The at least one first processor may be configured to transmit a payment request signal, which requests wireless transmission of payment information, to an electronic device through the first communication interface on the basis of the acquired authentication data.
Inventors:
KANG CHANGTAEK (KR)
SON DONGIL (KR)
SON DONGIL (KR)
Application Number:
PCT/KR2023/018237
Publication Date:
May 23, 2024
Filing Date:
November 14, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06Q20/32; G02B27/01; G06F3/00; G06F3/01; G06Q20/40; G06V40/20; H04W4/80
Foreign References:
| KR20160133972A | 2016-11-23 | |||
| KR20180013173A | 2018-02-07 | |||
| KR20170090490A | 2017-08-07 | |||
| KR20170088655A | 2017-08-02 | |||
| KR20160055680A | 2016-05-18 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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