Title:
HEAT CONDUCTIVE SHEET AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/179115
Kind Code:
A1
Abstract:
A heat conductive sheet which contains a matrix resin and heat conductive particles, and which is configured such that: 200 parts by volume or more of the heat conductive particles are contained per 100 parts by volume of the matrix resin component; the matrix resin component has a polymer viscosity of 500 Pa∙s or less at 25°C after being subjected to a crosslinking reaction without containing the heat conductive particles; the heat conductivity of the heat conductive sheet is 2.0 W/m∙K or more; and with respect to the 50% compression load of the heat conductive sheet, which has an initial thickness of 1.5 mm, the maximum load is 100 kPa or more and the load after one minute is more than 0 kPa but 100 kPa or less if compressed at a compression rate of 5.0 mm/min. Consequently, the present invention provides a soft heat conductive sheet which has a high heat conductivity and a low steady load.
Inventors:
SHIBUYA HITOSHI
Application Number:
PCT/JP2019/038909
Publication Date:
September 10, 2020
Filing Date:
October 02, 2019
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
H01L23/373; C08K3/22; C08L83/05; C08L83/07
Domestic Patent References:
| WO2014034508A1 | 2014-03-06 | |||
| WO2019098290A1 | 2019-05-23 |
Foreign References:
| JP2005042096A | 2005-02-17 | |||
| JP2015201573A | 2015-11-12 | |||
| JP2002261206A | 2002-09-13 | |||
| JP2003145041A | 2003-05-20 | |||
| JP2013147600A | 2013-08-01 | |||
| JP2003253136A | 2003-09-10 | |||
| JP2001217360A | 2001-08-10 |
Other References:
See also references of EP 3726573A4
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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