Title:
HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/135638
Kind Code:
A1
Abstract:
The present application provides a heat dissipation structure. The heat dissipation structure comprises: a cold plate (10), comprising a plate body (12) and fins provided on the back of the plate body (12), a pipe (112) being provided in the plate body (12), the front face of the plate body (12) being used for arrangement of chips (30); and a water pump (20) fixed on the front face (10) of the cold plate, an inlet (21) and an outlet (22) of the water pump (20) being respectively in communication with the pipe (112).
Inventors:
LIU XIN (CN)
Application Number:
PCT/CN2019/128902
Publication Date:
July 02, 2020
Filing Date:
December 26, 2019
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01L23/34
Foreign References:
| CN105682434A | 2016-06-15 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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