Title:
HEAT-RESISTANT ADHESIVE FILM FOR PRINTED BOARD AND METHOD OF USE THEREOF
Document Type and Number:
WIPO Patent Application WO/1994/014911
Kind Code:
A1
Abstract:
A heat-resistant adhesive film for printed boards which has silicon units and comprises a polyimide resin and an epoxy resin. The film may contain, if necessary, an epoxy resin curing agent and a polyimide resin structure may have a functional group reactive with the epoxy resin. It is used by interposing between the adherents and applying a pressure of 1-1,000 kg/cm2 at a temperature of 20-250 °C. This film is excellent in heat resistance, wet soldering-heat resistance and processability under a thermal pressing condition below 250 °C.
Inventors:
OHMORI FUMIHIRO (JP)
WADA YUKIHIRO (JP)
YUASA MASATOSHI (JP)
WADA KEIICHIROU (JP)
SHIMOSE MAKOTO (JP)
NAKAJAMI KENJI (JP)
OHKUBO MISAO (JP)
WADA YUKIHIRO (JP)
YUASA MASATOSHI (JP)
WADA KEIICHIROU (JP)
SHIMOSE MAKOTO (JP)
NAKAJAMI KENJI (JP)
OHKUBO MISAO (JP)
Application Number:
PCT/JP1993/001902
Publication Date:
July 07, 1994
Filing Date:
December 27, 1993
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
OHMORI FUMIHIRO (JP)
WADA YUKIHIRO (JP)
YUASA MASATOSHI (JP)
WADA KEIICHIROU (JP)
SHIMOSE MAKOTO (JP)
NAKAJAMI KENJI (JP)
OHKUBO MISAO (JP)
OHMORI FUMIHIRO (JP)
WADA YUKIHIRO (JP)
YUASA MASATOSHI (JP)
WADA KEIICHIROU (JP)
SHIMOSE MAKOTO (JP)
NAKAJAMI KENJI (JP)
OHKUBO MISAO (JP)
International Classes:
C08G73/10; B32B7/12; C08L79/08; C09J5/06; C09J7/10; C09J163/00; C09J179/08; C09J183/10; H05K3/38; C08L63/00; C08L83/10; H05K3/28; H05K3/46; (IPC1-7): C09J7/00; C09J163/00; C09J183/04; C09J179/08
Foreign References:
| JPH02158681A | 1990-06-19 | |||
| JPS60210624A | 1985-10-23 | |||
| JPH0525453A | 1993-02-02 | |||
| JPH05140526A | 1993-06-08 | |||
| JPH0525452A | 1993-02-02 | |||
| JPH0436321A | 1992-02-06 | |||
| JPH0496962A | 1992-03-30 |
Other References:
See also references of EP 0676456A4
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