Title:
HEAT SINK, HEAT SINK ASSEMBLY, ELECTRONIC INSTRUMENT, AND METHOD FOR MANUFACTURING HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2020/138223
Kind Code:
A1
Abstract:
This heat sink (100) is provided with: a first heat dissipating member (2) including a plurality of corner sections extending in a first direction and a plurality of side sections connected to each other via one corner section; and a plurality of second heat dissipating members (3) connected to each of the plurality of side sections. Each of the plurality of corner sections is provided with at least one recess section (23). Each of the plurality of corner sections is a bent section formed by being bent with respect to each recess section (23) as the bending axis. The plurality of second heat dissipating members (3) are disposed further inward than the first heat dissipating member (2).
Inventors:
TANISHITA TOMOHIRO (JP)
HARADA KEIJI (JP)
TSUNODA YOSHIKAZU (JP)
SHIRAKATA YUJI (JP)
HARADA KEIJI (JP)
TSUNODA YOSHIKAZU (JP)
SHIRAKATA YUJI (JP)
Application Number:
PCT/JP2019/050979
Publication Date:
July 02, 2020
Filing Date:
December 25, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; H01L23/40; H01L23/427; H05K7/20
Foreign References:
| JP2001223308A | 2001-08-17 | |||
| JP2010288400A | 2010-12-24 | |||
| JPH10248198A | 1998-09-14 | |||
| JP2001274298A | 2001-10-05 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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