Title:
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/200685
Kind Code:
A1
Abstract:
A high-frequency dielectric heating adhesive sheet (1) includes: a first adhesive layer (10) that contains a first thermoplastic resin and a first dielectric filler; and a second adhesive layer (20) that contains a second thermoplastic resin and a second dielectric filler. The first thermoplastic resin volume content VA1 in the first adhesive layer (10) and the second thermoplastic resin volume content VA2 in the second adhesive layer (20) are 60-100 vol%, and the change ratios V×1 and V×2 are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer that is in direct contact with the first adhesive layer (10), and VB2 is the volume content of the second thermoplastic resin in a layer that is in direct contact with the second adhesive layer (20). (Formula 1): V×1 = {(VA1-VB1)/VA1} ×100
(Formula 2): V×2 = {(VA2-VB2)/VA2} ×100
Inventors:
TAYA NAOKI (JP)
MIYATA SOU (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2021/012957
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J7/30; C09J201/00
Domestic Patent References:
| WO2018186297A1 | 2018-10-11 |
Foreign References:
| JPH08258173A | 1996-10-08 | |||
| JPH08281873A | 1996-10-29 | |||
| JP2014037489A | 2014-02-27 | |||
| JPS58174474A | 1983-10-13 |
Other References:
See also references of EP 4129657A4
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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