Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/101383
Kind Code:
A1
Abstract:
Provided is a high-frequency module that makes it possible to reliably shield a component that needs shielding without shielding components that do not need shielding. A high-frequency module 1a that comprises: a multilayer wiring board 2; a plurality of components 3a, 3b that are mounted on the multilayer wiring board 2 and sealed in a sealing resin layer 4; a plurality of metal pins 3a that are provided so as to stand on an upper surface 20a of the multilayer wiring board 2; and a shielding film 6 that coats a portion of the surface of the sealing resin layer 4. The shielding film 6 has an upper surface coating portion 6a that coats an upper surface 40a of the sealing resin layer 4 and is formed to coat above a prescribed component 3b and not to coat above the other component 3a. The prescribed component 3b is surrounded by the plurality of metal pins 5a and the shielding film 6.
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2017/042967
Publication Date:
June 07, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H05K9/00
Domestic Patent References:
| WO2016181954A1 | 2016-11-17 |
Foreign References:
| US20120217048A1 | 2012-08-30 | |||
| US20120228751A1 | 2012-09-13 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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