Title:
HOUSING FOR ELECTRONIC BOARDS
Document Type and Number:
WIPO Patent Application WO2005101940
Kind Code:
A3
Abstract:
The invention relates to a housing for electronic boards (10), which comprises at least one heat-generating component (11) and which is of the type that comprises side walls (2, 3, 4 and 5) and a base (6). The invention is characterised in that the base (6) comprises a series of ribs (7, 8) with boxes (9) disposed therebetween. According to the invention, the aforementioned boxes (9) are designed to receive a resin (13) at the point corresponding to the position of the heat-generating component, said resin being intended to facilitate heat exchange between the inside and the outside of the housing (1).
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Inventors:
LEXUAN JEAN (FR)
BOURSEAU ERIC (FR)
BOURSEAU ERIC (FR)
Application Number:
PCT/FR2005/000812
Publication Date:
January 12, 2006
Filing Date:
April 04, 2005
Export Citation:
Assignee:
VALEO ELECTRONIQUE SYS LIAISON (FR)
LEXUAN JEAN (FR)
BOURSEAU ERIC (FR)
LEXUAN JEAN (FR)
BOURSEAU ERIC (FR)
International Classes:
H05K7/20; (IPC1-7): H05K7/20
Foreign References:
| US5706171A | 1998-01-06 | |||
| US4520426A | 1985-05-28 | |||
| GB1365877A | 1974-09-04 | |||
| DE2345626A1 | 1975-03-20 |
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