ILLUMINATED MULTI-MODAL MATRIX SENSING ARRAY

BACKGROUND

Typical user interface devices, such as touch panels, keypads or keyboards, comprise of discrete touch sensing nodes or discrete mechanical switches arranged in some form of matrix sensing array configuration. Illumination of the touch panel, keypad or keyboard is typically provided using a uniform backlighting source, such as LED.

Key limitations include the following:

BRIEF DESCRIPTION OF DRAWINGS

Fig. 1 illustrates an example sensing and illumination system including a sensing layer and an illumination unit.

Fig. 2 shows a combination of physical stack-up of input sensing and output illumination, which is configured as an illuminated input sensing device.

Figs. 3A, 3B, 3C, 3D, 4A, and 4B show an embodiment of a physical topology defined as a matrix sensing topology I as top view and cross-sectional view, respectively.

Figs. 5A, 5B, 5C, 5D, 6A and 6B show an alternative embodiment physical topology defined as matrix sensing topology II as top view and cross-sectional view, respectively.

Figs. 7A, 7B, 7C. 7D, 8A and 8B show an alternative embodiment physical topology defined as matrix sensing topology III as top view and cross-sectional view, respectively.

Figs. 9A and 9B illustrate an example of output sensing characteristics for a typical force sensing element known as a force sensing resistor (FSR) and a novel force sensing device defined as force sensing device (FSD), respectively;

Figs. 10A and 10B illustrate differences in the electrode topology between an FSR (Fig. lOa) and an FSD (Fig. lOb).

DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are explicitly contemplated herein.

Typical user interface devices, such as touch panels, keypads or keyboards, comprise of discrete touch sensing nodes or discrete mechanical switches arranged in some form of matrix sensing array configuration. Illumination of the touch panel, keypad or keyboard is typically provided using a uniform backlighting source, such as LED. This invention proposes a unique approach of combining a matrix sensing array of force/pressure sensing elements and a matrix array of LEDs simultaneously. The former and latter devices are functioning as input and output, respectively as a multi-modal device or system.

Various embodiments disclosed herein relate to designs and implementations of a multi-modal sensing array with matrix illumination (e.g., for human-machine interface (HMI) applications). For example, some embodiments may relate to a unique approach of combining a sensing array of force/pressure sensing elements and an array of light emitting diodes (LEDs) (e.g., substantially simultaneously). An input modality of a sensing and illumination system may include, but is not limited to, multi-touch sensing, discrete force/pressure node and/or gestures. Further, an output modality of a sensing and illumination system may include, but is not limited to, multi-node illumination, illumination intensity, illumination modulation, and/or illumination color.

Fig. 1 illustrates an example sensing and illumination system 100, in accordance with various embodiments of the present disclosure. For example, sensing and illumination system 100 may be implemented within a human interface device (HID) (e.g., a touchpad, a touchscreen, a keyboard, a keypad, and the like), which may be part of an electronic device (e.g., a computing device, a tool, a measurement device, etc.). Sensing and illumination system 100, which may also be referred to herein as a “sensing system” or a“sensing architecture,” includes a sensing surface 102, a sensing layer 104, and an illumination unit 106. Sensing and illumination system 100 also includes a controller 108 (e.g., a multi-modal controller), a controller 110 (e.g., an AndroidTM, iOSTM, or WindowsTM controller) including an interface 111 (e.g., BLE and/or USB interface), and a graphics user interface (GUI) 112.

As described more fully below, sensing surface 102, which may include an exterior surface of, for example, a display device (e.g., a touch screen), may be configured to receive user input. For example, sensing surface 102, which may also be referred to herein as an“illuminated force sensing surface” may include one or more light diffuser elements and a force actuator. In some embodiments, the force actuator may be selected to achieve an appropriate Young’s modulus property (e.g., to achieve one or more desired force sensing characteristics).

Sensing layer 104 may be positioned near (e.g., adjacent) sensing surface 102 and may be configured to sense force, pressure, and/or gestures applied to and/or made proximate to sensing surface 102 (e.g., in response to the user input). For example, sensing layer 104 may include one or more sensing nodes. The one or more sensing nodes may include, for example, one or more force sensing elements, one or more strain sensing elements, and/or one or more environmental sensing elements. In accordance with various embodiments, an input modality may include, for example, multi-touch sensing, discrete force/pressure sensing, and/or gesture (e.g., hand gesture) sensing.

Sensing layer 104, which may be flexible (e.g., including a flexible printed circuit) or rigid (e.g., including a printed circuit board), may include any number of sensing nodes arranged in any configuration. In some embodiments, sensing nodes may be printed on a PCB or a flexible circuit board. For example, sensing layer 104 may include an array of sensing nodes, arranged in columns and rows. More specifically, for example, sensing layer 104 may include a matrix array of 400 sensing nodes, arranged in 20 columns and 20 rows. In at least one embodiment, the sensing nodes may be arranged in accordance with a layout of a keyboard. For example, some or all of the sensing nodes may correspond to a particular key on the keyboard. Each of the sensing nodes that corresponds to a particular key may be arranged to substantially align with the respective key. In at least one embodiment, some sensing nodes may not correspond to a key on the keyboard. Such sensing nodes may be referred to as interstitial sensing elements. The interstitial sensing elements may be configured to receive user input that is not intended to activate a particular key of the keyboard.

Illumination unit 106, which may also be referred to herein as a“light emitting diode (LED) array,” may include a plurality of LEDs. The LEDs may include red, blue and green (RGB) LEDs, single color LEDs, or any combination thereof. According to various embodiments, an output modality may include, for example, multi-node illumination, illumination intensity, illumination modulation, and/or illumination color.

As described more fully herein, in some embodiments, one or more LEDs of illumination unit 106 may be position adjacent (e.g., around) each sensing node of sensing layer 104. In other embodiments, each LED of illumination unit 106 may be located directly within a sensing node of sensing layer 104. In yet other embodiments, a plurality of LEDs of illumination unit 106 may be positioned around a sensing node of sensing layer 104 (e.g., to form illumination onto a light guide ring and the light diffuser). In at least these embodiments, when an input modality is applied at a specific region, a surrounding LED may be illuminated onto the light guide ring and the light diffuser as the output modality. In some embodiments, the sensing nodes may include electrically responsive force sensing elements with a defined cut-out (e.g., to allow illumination onto the light diffuser region where external force is applied).

In various embodiments disclosed herein, in a printed circuit board (PCB) configuration, a PCB (e.g., of sensing layer 104) may include cut-outs and/or openings and LEDs (e.g., of illumination unit 106) may be reverse mounted to enable LED illumination onto a light diffuser layer (e.g., of sensing layer 104). In a flexible printed circuit (FPC) configuration, LEDs (e.g., of illumination unit 106) may be mounted to a FPC (e.g., of sensing layer 104) without any cut-outs or openings. Further, in some embodiments, a force actuator layer (e.g., of sensing layer 104) may include a protrusion or dome configured as a force concentrator (e.g., such that an external applied force may be sensed via an associated sensing node).

Controller 108, which may be communicatively coupled to each of sensing layer 104 and illumination unit 106, may be configured to receive data (e.g., sensor data) and/or transmit one or more control signals from/to sensing layer 104 and/or illumination unit 106. In at least some embodiments, controller 108, which may include a multi -model HMI controller, may perform various analyses based on data received from one or more sensing nodes (e.g., of sensing layer 104). In at least some embodiments, controller 108 may be configured to translate and determine a translation of one or more input modalities into one or more output modalities.

For example, controller 108 may include a processor configured to execute computational processing of dynamic force detection and measurement data from force sensing elements. Further, the processor may use the dynamic force detection and measurement data to, for example, determine a force/pressure map across some or all of a surface (e.g., surface 102). The processor may also be configured to execute computational processing of dynamic strain detection and measurement data from strain sensing elements. Moreover, the processor may be configured to execute computational processing of dynamic environmental sensing data received from one or more environmental sensing elements. The processor may also use the environmental sensing data to achieve dynamic environmental compensation of force sensing elements and the strain sensing elements. The processor may further be configured to execute computational processing of dynamic motion sensing data received from one or more motion sensing elements. Furthermore, the processor may use the motion sensing data to achieve dynamic motion compensation of force sensing elements, the strain sensing elements and/or the environmental sensing elements.

In some embodiments, controller 108 may also include an embedded host controller. The host controller may include circuitry configured to receive data from one or more sensing nodes. The host controller may include a memory to store the data and a processor to execute operations.

The embedded host controller may be electronically connected to a client device via a communication link. In at least one embodiment, the sensor may be coupled to the client device via a communication link. The communication link may provide any form of wired or wireless communication capability between a device (e.g., controller 108) and any other device. In some embodiments, the communication link may include a radio frequency (RF) antenna. By way of example and not limitation, the communication link may be configured to provide, via wireless mechanisms, LAN connectivity, Bluetooth connectivity, Bluetooth Low Energy (BLE), Wi-Fi connectivity, NFC connectivity, M2M connectivity, D2D connectivity, GSM connectivity, 3G connectivity, 4G connectivity, LTE connectivity, any other suitable communication capability, or any suitable combination thereof. Sensing and illumination system 100 may include any number of communication links. The communication link may provide various functionality, such as an Android® controller and display module, game engine visualization, various modes (e.g., walking and running modes), a BLE interface, USB interface, etc.

Sensing and illumination system 100 may also include a haptic feedback unit 116 that may drive haptic feedback to sensing and illumination system 100. For example, a controller (e.g., controller 108 and/or an embedded controller) may receive sensor data from a sensing array (e.g., of sensing layer 104). Based on the sensor data, the embedded controller may generate and send instructions to the haptic feedback unit 116 to produce a haptic response via the system (e.g., as a haptic feedback that a user may feel). Example haptic feedback may include, but are not limited to, a press, a pulse, a shock, a release, all of which may be short, long, or repeated. The haptic feedback may be used to indicate various input and/or output operations.

Fig. 2 shows a combination of physical stack-up of input sensing and output illumination, which is configured as an illuminated input sensing device 100. As such, Fig. 2 shows an embodiment of the physical configuration of the input sensing device 100 for implementing the illuminated force sensing surface layer 102, translucent matrix force sensing layer 104, and matrix LED illumination layer 106. The illuminated force sensing surface layer 102 includes light diffuser elements 410, 610, 810 and a force actuator 420, 620, 820 (Figures 4A, 4B, 6A, 6B, 8A, and 8B). In particular, each force actuator 420, 620, 820 can be selected to achieve the appropriate Young’s modulus property to achieve the desired force sensing characteristics. The translucent matrix force sensing layer 104 includes at least one sensing node 430, 630, 830 (Figures 4A, 4B, 6A, 6B, 8A, and 8B). In particular, each sensing node 430, 630, 830 can include a sensor that detects contact or pressure or heat or proximity, or other indication of a force being applied to the illuminated force sensing surface layer 102 above the sensing node 430, 630, 830. The matrix LED illumination layer 106 includes a substrate 440, 442, 640, 642, 840, 842 (e.g., printed circuit board“PCB” 440, 640, 840 or flexible printed circuit“FPC” 442, 642, 842). The matrix LED illumination layer 106 also includes a LED 450, 452, 650, 652, 850, 852 (e.g., reverse mounted 450, 650, 850 or forward mounted 452, 652, 852), which is mounted or coupled with the substrate 440, 442, 640, 642, 840, 842.

In Fig. 3, the illuminated force sensing surface has been omitted for clarity. In this topology, multiple LEDs are located around the sensing node. Cut-outs or openings are created in the PCB configuration where LEDs are reverse mounted to enable LED illumination onto the light diffuser layer. In the FPC configuration, LEDs are mounted without any cut-outs or openings. The force actuator layer comprises of a 3-dimensional protrusion or dome, acting as a force concentrator, to ensure that external applied force is transmitted onto the sensing node. The input modality consists of, but is not limited to, multi-touch sensing, discrete force/pressure and gestures applied on the illuminated force sensing surface. The output modality consists of, but is not limited to, multi-node illumination, illumination intensity and illumination color. When input modality is applied at a specific region, one or more adjacent LEDs will be illuminated as the output modality.

Fig. 3A illustrates the illuminated input sensing device 400 of one of the embodiments, comprising a topology 300 having at least one light emitting region 302 and at least one sensing region 304 separated from each other by a boundary region 306.

Fig. 3B illustrates the illuminated input sensing device 400 of one of the embodiments, wherein the topology 300 includes the illuminated force sensing surface layer 102 having: the light emitting region 302 configured as an aperture 308 having a diffuser element 410 within the aperture 308; and the sensing region 304 configured as a force actuator 420, wherein the light emitting region 302 and sensing region 304 are separated from each other by a surface layer body 406.

Fig. 3C illustrates the illuminated input sensing device 400 of one of the embodiments, wherein the topology 300 includes the translucent matrix force sensing layer 104 having: the light emitting region 302 configured as an aperture 412 and optionally having a light guide 435 within the aperture 412; and the sensing region 304 configured as a sensing node 430, wherein the light emitting region 302 and sensing region 304 are separated from each other by a sensing layer body 408.

Fig. 3D illustrates the illuminated input sensing device 400 of one of the embodiments, wherein the topology 300 includes the matrix LED illumination layer 106 having: the light emitting region 302 configured as an LED 450, 452; and the sensing region 304 configured as a substrate 440, 442, wherein the light emitting region 302 and sensing region 304 are separated from each other by the substrate 440a, 442a.

Fig. 4A illustrates the illuminated input sensing device 400 of one of embodiments, comprising a configuration 400a having at least one light emitting region 302 and at least one sensing region 304 separated from each other by a boundary region 306.

Fig. 4B illustrates the illuminated input sensing device 400 of one of the embodiments, having a configuration 400b that includes the matrix LED illumination layer 106 having: the light emitting region 302 configured as a forward LED 452; and the sensing region 304 configured as a substrate 442 in a form of a flexible printed circuit (FPC), wherein the light emitting region 302 and sensing region 304 are separated from each other by the substrate 442a.

Figs. 5A, 5B, 5C, 5D, 6A, and 6B show an alternative embodiment physical topology defined as matrix sensing topology II as top view and cross-sectional view, respectively. In this topology, each LED is located directly within the sensing node. The sensing node comprises of electrically responsive force sensing elements with a defined cut-out to allow illumination onto the light diffuser region where external force is applied. Cut-outs or openings are created in the PCB configuration where LEDs are reverse mounted to enable LED illumination onto the light diffuser layer. In the FPC configuration, LEDs are mounted without any cut-outs or openings. The force actuator layer comprises of a 3-dimensional protrusion or dome, acting as a force concentrator, to ensure that external applied force is transmitted onto the sensing node. The input modality consists of, but is not limited to, multi-touch sensing, discrete force/pressure and gestures applied on the illuminated force sensing surface. The output modality consists of, but is not limited to, multi-node illumination, illumination intensity and illumination color. When input modality is applied at a specific region, the corresponding LED will be illuminated as the output modality.

Fig. 7A, 7B, 7C, 7D, 8 A and 8B show an alternative embodiment physical topology defined as matrix sensing topology III as top view and cross-sectional view, respectively. In this topology, multiple LEDs are located around the sensing node to form illumination onto the light guide ring and the light diffuser. The sensing node comprises of electrically responsive force sensing elements with a defined cut-out to allow illumination onto the light diffuser region where external force is applied. Cut-outs or openings are created in the PCB configuration where LEDs are reverse mounted to enable LED illumination onto the light diffuser layer. In the FPC configuration, LEDs are mounted without any cut-outs or openings. The force actuator layer comprises of a 3- dimensional protrusion or dome, acting as a force concentrator, to ensure that external applied force is transmitted onto the sensing node. The input modality consists of, but is not limited to, multi -touch sensing, discrete force/pressure and gestures applied on the illuminated force sensing surface. The output modality consists of, but is not limited to, multi-node illumination, illumination intensity and illumination color. When input modality is applied at a specific region, the surrounding LED will be illuminated onto the light guide ring and the light diffuser as the output modality.

Figs. 9A and 9B illustrate an example of output sensing characteristics for a typical force sensing element known as a force sensing resistor (FSR) and a novel force sensing device defined as force sensing device (FSD), examples of which are illustrated and described with reference to Figs. 10A and 10B. Figs. 9a and 9b illustrate the distinction in linearity between the typical FSR compared to an example FSD in accordance with the present disclosure. A typical analog circuit implementation of the FSR may include the use of a voltage divider circuit where a fixed resistor is connected to ground and in series with the force sensing element which is also connected to a voltage supply. An inherent limitation of the FSR is highly non-linear characteristic for the voltage divider circuit output when the external force is applied on the FSR. Figs. 9A and 9B illustrates a linear regression curve fitting for the range of force from 1 to 10 N in the case of the FSR. As illustrated in Fig. 9A, the amount of voltage change observed with the application of various forces changes steeply for low amounts of force and tapers off for higher applied forces. The solid line represents raw data of observed voltages for force values. The dashed line represents a linear regression curve fitting. As observed, the coefficient of determination (R ² ) for the curve illustrated in Fig. 9a is a value of 0.8515.

Fig. 9b illustrates a linear regression curve fitting for the range of force from 0.5 to 10.5 N in the case of the FSD in accordance with the present disclosure. As with Fig. 9a, the solid line represents raw data of observed voltages for force values, and the dashed line represents a linear regression curve fitting. As illustrated when comparing Fig. 9b to Fig. 9a, use of the FSD shows a significantly improved linear regression curve fitting. For example, the value of R2 for the curve illustrated in Fig. 9b is a value of 0.98.

Figs. lOa and lOb provide an example of each of an FSR and FSD, respectively. Figs. lOa and lOb illustrate differences in the electrode topology between an FSR lOOOa (Fig. lOa) and an FSD lOOOb (Fig. lOb). As illustrated in Fig. lOa, the topology of an FSR lOOOa may include first and second electrodes l020a and l030a arranged in a horizontal distribution for a generally circular force sensing region lOlOa. A series of horizontally overlapping arms (e.g., the arms l022a of the first electrode l020a and the arms l032a of the second electrode l030a) that are discrete between the first and second electrodes l020a and l030a may be utilized. For example, starting from the bottom of Fig. lOa, the first electrode l020a may have a first arm l022a that extends through the majority of the region between the first electrode l020a and the second electrode l030a. Directly above but not in contact with the first arm l022a of the first electrode l020a may be a first arm l032a of the second electrode l030a. The arms l022a and l032a may alternate through the entire circular force sensing region lOlOa. Additionally, the entire region between the two electrodes may include arms l022a and l032a filling the space. The spacing between the arms l022a and l032a may be generally uniform across the length of the arms.

As illustrated in Fig. lOb, the topology of the example FSD lOOOb in accordance with the present disclosure may include a first electrode l020b and a second electrode l030b to implement a generally circular force sensing region 1010b. The two electrodes l020b and l030b may be arranged in a semi-circular and radial configuration, rather than a horizontal configuration as illustrated in Fig. lOa. For example, arms l022b of the first electrode l020b and arms l032b of the second electrode l030b may project from an outer region of the circular force sensing region 1010b radially inwards towards the center of the circular force sensing region lOlOb. In some embodiments, the arms l022b of the first electrode l020b and the arms l032b of the second electrode l030b may stop short of the middle of the circular force sensing region lOlOb, leaving a gap in a central region 1040 without any conductive material. In some embodiments, the central region 1040 may be between approximately 0% and 50% of the circular force sensing region lOlOb, and may also fall in the range of 5% and 40%, or between 5% and 25%, etc.

In some embodiments, the arms l022b of the first electrode l020b and the arms l032b of the second electrode l030b may be shaped to taper as they progress radially in towards the central region 1040 due to the radially projecting shape of the arms l022b and l032b. Such a shape may result in a variation in distance between successive arms at the edges of the circular force sensing region lOlOb compared to the center of the circular force sensing region lOlOb. For example, the distance between successive arms may be greater proximate the edges of the circular force sensing region lOlOb and smaller when closer to the center of the circular force sensing region lOlOb.

In some embodiments a gap may be placed between the first electrode l020b and the second electrode l030b. As illustrated in Figure lOb, the gap may be located at approximately the top and bottom of the circular force sensing region lOlOb.

In some embodiments, sizes of the FSD lOOOb may be as explained herein, although any size or dimension of the FSD lOOOb may be included. As illustrated herein, the width of the arms l022b and/or l032b may be between approximately 0.05 and 3.0 mm. The diameter of the force sensing region lOlOb may be between approximately 3 and 30 mm. The gap between the first electrode l020b and the second electrode 1030b may be between approximately 0.05 and 0.5 mm. The central region 1040 may be between approximately 0.5 and 2.0 mm.

In some embodiments, the use of the FSD lOOOb illustrated in Fig. lOb may facilitate a decrease in manufacturing costs and waste in material when compared to the FSR lOOOa as illustrated in Fig. lOa. For example, the first and second electrodes l020b and l030b of the FSD lOOOb may be symmetrical about a vertical axis such that two copies of a single electrode may be used, and flipped over to create the FSD lOOOb. In contrast, two unique electrodes are created when forming the FSR lOOOa.

In some embodiments, the various features described for the topology of the FSD lOOOb may contribute to a more linear relationship between voltage change and force application when compared to the FSR lOOOa. For example, as described above with reference to Figs. 9a and 9b, the value of R ² for the curve illustrated in Fig. 9a associated with the FSR is a value of 0.8515, while the value of R ² for the curve illustrated in Fig. 9b associated with the FSD is a value of 0.98.

An illuminated input sensing device 100 can include: an illuminated force sensing surface layer 102; a translucent matrix force sensing layer 104; and a matrix LED illumination layer 106.

The illuminated input sensing device 400, 600, 800 of one of the embodiments, wherein the illuminating force sensing surface layer 102 includes at least one light diffuser element 410, 610, 810 and at least one force actuator 420, 620, 820.

The illuminated input sensing device 400, 600, 800 of one of the embodiments, wherein the translucent matrix force sensing layer 104 includes at least one sensing node 430, 630, 830.

The illuminated input sensing device 400, 600, 800 of one of the embodiments, wherein the translucent matrix force sensing layer 104 includes at least one light guide 435, 635, 835.

The illuminated input sensing device 400, 600, 800 of one of the embodiments, wherein the matrix LED illumination layer 106 includes a substrate 440, 442, 640, 642, 840, 842 (e.g., printed circuit board“PCB” 440, 640, 840 or flexible printed circuit “FPC” 442, 642, 842) and LED 450, 452, 650, 652, 850, 852 (e.g., reverse mounted 450, 650, 850 or forward mounted 452, 652, 852).

The illuminated input sensing device 400, 600, 800 of one of the embodiments, wherein the translucent matrix force sensing layer 104 is between the illuminated force sensing surface layer 102 and the matrix LED illumination layer 106.

The illuminated input sensing device 400 of one of the embodiments, wherein the configuration 400a includes the illuminated force sensing surface layer 102 having: the light emitting region 302 configured as an aperture 308 having a diffuser element 410 within the aperture 308; and the sensing region 304 configured as a force actuator 420, wherein the light emitting region 302 and sensing region 304 are separated from each other by a surface layer body 406, wherein the force actuator 420 is a separate material from the surface layer body 406.

The illuminated input sensing device 400 of one of the embodiments, wherein the configuration 400a includes the illuminated force sensing surface layer 102 having: the light emitting region 302 configured as an aperture 308 having a diffuser element 410 within the aperture 308; and the sensing region 304 configured as a force actuator 420, wherein the light emitting region 302 and sensing region 304 are separated from each other by a surface layer body 406, wherein the force actuator 420 is a uniform material with the surface layer body 406.

The illuminated input sensing device 400 of one of the embodiments, wherein the force actuator 420 is mounted on an internal surface 406a of the surface layer body 406.

The illuminated input sensing device 400 of one of the embodiments, wherein the force actuator 420 is a protrusion extending from an internal surface 406a of the surface layer body 406.

The illuminated input sensing device 400 of one of the embodiments, wherein the force actuator 420 is a dome extending from an internal surface 406a of the surface layer body 406.

The illuminated input sensing device 400 of one of the embodiments, wherein a plurality of the sensing regions 304 are adjacent to four light emitting regions 302 arranged at comers of a square.

The illuminated input sensing device 400 of one of the embodiments, wherein a plurality of the light emitting regions 302 are adjacent to four sensing regions 304 arranged at comers of a square. The illuminated input sensing device 400 of one of the embodiments, wherein: each light emitting region 302 has a diameter Dl; and each sensing region 304 has a diameter D2, wherein Dl is smaller, the same as, or larger than D2.

The illuminated input sensing device 400 of one of the embodiments, wherein: each pair of sensing regions 304 has center to center distance of Xmm in an X plane; and each pair of sensing regions 304 has center to center distance of Ymm in an Y plane.

The illuminated input sensing device 400 of one of the embodiments, wherein: each pair of light emitting regions 302 has center to center distance of Xmm in an X plane; and each pair of light emitting regions 302 has center to center distance of Ymm in a Y plane.

The illuminated input sensing device 400 of one of the embodiments, wherein the aperture 412 is filled with air or light guide 435.

The illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 is optically translucent or optically opaque.

The illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 is a different material from the light guide 435 and/or sensing node 430.

The illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 extends between the illuminating force sensing surface layer 102 and matrix LED illumination layer 106.

The illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 extends between the illuminating force sensing surface layer 102 and matrix LED illumination layer 106 with an irregular top surface facing the illuminating force sensing surface layer 102 and receiving the light diffuser 410 and force actuator 420 and an irregular bottom surface facing the matrix LED illumination layer and receiving the LED 450 and sensing node 430.

The illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 is air.

The illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 at the sensing region 304 and the body region 306 therearound is air or a malleable or flexibly resilient or elastomeric material that allows for the force actuator 420 to apply a force to the sensing node 430.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is a reverse mounted LED 450.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is a reverse mounted LED 450 mounted on an LED substrate 451.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is a visible light LED.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is a color light LED.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is a white light LED.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is at least one LED capable of emitting at least one color and/or white light.

The illuminated input sensing device 400 of one of the embodiments, wherein the substrate 440 is a printed circuit board (PCB).

The illuminated input sensing device 400 of one of the embodiments, wherein the substrate 440 is a printed circuit board assembly (PCBA) having one or more electronic components.

The illuminated input sensing device 400 of one of the embodiments, wherein the substrate 440 is a printed circuit board assembly (PCBA) having one or more electronic components selected from an LED controller, LED driver, resistors, integrated circuits, capacitors, or the like.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 452 is mounted on the substrate 442.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 450 is mounted within a recess in the substrate 440.

The illuminated input sensing device 400 of one of the embodiments, wherein the LED 452 is part of the translucent matrix force sensing layer 104 by being mounted on the substrate 442 laterally or about laterally from the sensing node 430.

The illuminated input sensing device 400 of one of the embodiments, wherein components in Figure 4A are also in Figure 4B except for the LED 452 and FPC substrate 442.

The illuminated input sensing device 600 of one of the embodiments, comprising a topology 500 having a light emitting region 502 within an annular sensing region 504.

The illuminated input sensing device 600 of one of the embodiments, comprising a topology 500 having a light emitting region 502 within an annular sensing region 504, which are separated from other light emitting regions 502 within annular sensing regions 504 by a boundary region 506.

The illuminated input sensing device 600 of one of the embodiments, wherein the topology 500 includes the illuminated force sensing surface layer 102 having: the light emitting region 502 configured as an aperture 508 having a diffuser element 610 within the aperture 508; and the sensing region 504 configured as a force actuator 620, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by a surface layer body 606.

The illuminated input sensing device 600 of one of the embodiments, wherein the topology 500 includes the translucent matrix force sensing layer 104 having: the light emitting region 502 configured as an aperture 512 and optionally having a light guide 635 within the aperture 512; and the sensing region 504 configured as an annular sensing node 630, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by a sensing layer body 608.

The illuminated input sensing device 600 of one of the embodiments, wherein the topology 500 includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as an LED 650, 652; and the sensing region 504 configured as a substrate 640, 642, wherein the light emitting region 502 and sensing region 504 are separated from each other by the substrate 640a, 642a.

The illuminated input sensing device 600 of one of the embodiments, having a configuration 600a that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a reverse mounted LED 650; and the sensing region 504 configured as a substrate 640 as a printed circuit board (PCB) having the reverse mounted LED 650, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.

The illuminated input sensing device 600 of one of the embodiments, having a configuration 600a that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a reverse mounted LED 650; and the sensing region 504 configured as a substrate 640 as a printed circuit board (PCB) having the reverse mounted LED 650, wherein the reverse mounted LED 650 is below the annular sensing node 630, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.

The illuminated input sensing device 600 of one of the embodiments, having a configuration 600b that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward mounted LED 652; and the sensing region 504 configured as a substrate 642 as a flexible printed circuit (FPC) having the forward mounted LED 650 thereon, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.

The illuminated input sensing device 600 of one of the embodiments, having a configuration 600b which includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward mounted LED 652; and the sensing region 504 configured as a substrate 642 as a flexible printed circuit (FPC) having the forward mounted LED 650 in an aperture of the annular sensing node 630, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.

The illuminated input sensing device 600 of one of the embodiments, wherein the force actuator 620 is mounted on an internal surface 606a of the surface layer body 606.

The illuminated input sensing device 600 of one of the embodiments, wherein the force actuator 620 is a protrusion extending from an internal surface 606a of the surface layer body 606.

The illuminated input sensing device 600 of one of the embodiments, wherein the force actuator 620 is a dome extending from an internal surface 606a of the surface layer body 606.

The illuminated input sensing device 600 of one of the embodiments, wherein: each light emitting region 502 has a diameter Dl; and each sensing region 504 has a diameter D2, wherein Dl is smaller than D2.

The illuminated input sensing device 600 of one of the embodiments, wherein: each pair of sensing regions 504 has center to center distance of Xmm in an X plane; and each pair of sensing regions 504 has center to center distance of Ymm in an Y plane.

The illuminated input sensing device 600 of one of the embodiments, wherein: each pair of light emitting regions 502 has center to center distance of Xmm in an X plane; and each pair of light emitting regions 502 has center to center distance of Ymm in an Y plane.

The illuminated input sensing device 600 of one of the embodiments, wherein the aperture 512 is filled with air or light guide 635.

The illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 is optically translucent or optically opaque.

The illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 is a different material from the light guide 635 and/or sensing node 630.

The illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 extends between the illuminating force sensing surface layer 102 and matrix LED illumination layer 106.

The illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 extends between the illuminating force sensing surface layer 102 and matrix LED illumination layer 106 with an irregular top surface facing the illuminating force sensing surface layer 102 and receiving the light diffuser 610 and force actuator 620 and an irregular bottom surface facing the matrix LED illumination layer and receiving the LED 650 and sensing node 630.

The illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 is air.

The illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 at the sensing region 504 and the body region 606 therearound is air or a malleable or flexibly resilient or elastomeric material that allows for the force actuator 620 to apply a force to the sensing node 630.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is a reverse mounted LED 650.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is a reverse mounted LED 650 mounted on an LED substrate 651.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is a visible light LED.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is a color light LED.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is a white light LED. The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is at least one LED capable of emitting at least one color and/or white light.

The illuminated input sensing device 600 of one of the embodiments, wherein the substrate 640 is a printed circuit board (PCB).

The illuminated input sensing device 600 of one of the embodiments, wherein the substrate 640 is a printed circuit board assembly (PCBA) having one or more electronic components.

The illuminated input sensing device 600 of one of the embodiments, wherein the substrate 640 is a printed circuit board assembly (PCBA) having one or more electronic components selected from an LED controller, LED driver, resistors, integrated circuits, capacitors, or the like.

The illuminated input sensing device 600 of one of the embodiments, having a configuration 600b that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward LED 652; and the sensing region 504 configured as a substrate 642 in a form of a flexible printed circuit (FPC), wherein the light emitting region 502 and sensing region 504 are separated from each other by the substrate 642a.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 652 is mounted on the substrate 642.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 650 is mounted within a recess in the substrate 640.

The illuminated input sensing device 600 of one of the embodiments, wherein the LED 652 is part of the translucent matrix force sensing layer 104 by being mounted on the substrate 642 laterally or about laterally from the annular sensing node 630.

The illuminated input sensing device 600 of one of the embodiments, wherein components in Figure 6A are also in Figure 6B except for the LED 652 and FPC substrate 642.

The illuminated input sensing device 800 of one of the embodiments, comprising a topology 700 having an annular light emitting region 702 surrounding a sensing region 704.

The illuminated input sensing device 800 of one of the embodiments, comprising a topology 700 having an annular light emitting region 702 surrounding a sensing region 704, which are separated from other annular light emitting regions 702 surrounding sensing regions 704 by a boundary region 706.

The illuminated input sensing device 800 of one of the embodiments, wherein the topology 700 includes the illuminated force sensing surface layer 102 having: the light emitting region 702 configured as an annular aperture 708 having an annular diffuser element 810 within the annular aperture 708; and the sensing region 704 configured as a force actuator 820, wherein the light emitting region 702 and sensing region 704 are separated from other light emitting regions 702 and sensing regions 704 by a surface layer body 806.

The illuminated input sensing device 800 of one of the embodiments, wherein the topology 700 includes the translucent matrix force sensing layer 104 having: the light emitting region 702 configured as an annular aperture 712 and optionally having an annular light guide 835 within the annular aperture 712; and the sensing region 704 configured as a sensing node 830, wherein the light emitting region 702 and sensing region 704 are separated from other light emitting regions 702 and sensing regions 704 by a sensing layer body 808.

The illuminated input sensing device 800 of one of the embodiments, wherein the topology 700 includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as an LED 850, 852; and the sensing region 704 configured as a substrate 840, 842, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 840a, 842a.

The illuminated input sensing device 800 of one of the embodiments, comprising a configuration 800a that includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as a reverse mounted LED 850; and the sensing region 704 configured as a substrate 840 as a printed circuit board 840, wherein the light emitting region 702 and sensing region 704 are separated from other light emitting regions 702 and sensing regions 704 by separating substrate portions 840a.

The illuminated input sensing device 800 of one of the embodiments, comprising a configuration 800b that includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as a forward mounted LED 852; and the sensing region 704 configured as a substrate 842, wherein the light emitting region 702 and sensing region 704 are separated from other light emitting regions 702 and sensing regions 704 by separating substrate portions 842a. The illuminated input sensing device 800 of one of the embodiments, wherein the force actuator 820 is mounted on an internal surface 806a of the surface layer body 806.

The illuminated input sensing device 800 of one of the embodiments, wherein the force actuator 820 is a protrusion extending from an internal surface 806a of the surface layer body 806.

The illuminated input sensing device 800 of one of the embodiments, wherein the force actuator 820 is a dome extending from an internal surface 806a of the surface layer body 806.

The illuminated input sensing device 800 of one of the embodiments, wherein: each light emitting region 702 has a diameter Dl; and each sensing region 704 has a diameter D2, wherein D2 is smaller than Dl.

The illuminated input sensing device 800 of one of the embodiments, wherein: each pair of sensing regions 704 has center to center distance of Xmm in an X plane; and each pair of sensing regions 704 has center to center distance of Ymm in an Y plane.

The illuminated input sensing device 800 of one of the embodiments, wherein: each pair of light emitting regions 702 has center to center distance of Xmm in an X plane; and each pair of light emitting regions 702 has center to center distance of Ymm in an Y plane.

The illuminated input sensing device 800 of one of the embodiments, wherein the aperture 712 is filled with air or light guide 835.

The illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 is optically translucent or optically opaque.

The illuminated input sensing device 800, of one of the embodiments, wherein the sensing layer body 808 is a different material from the light guide 835 and/or sensing node 830.

The illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 extends between the illuminating force sensing surface layer 102 and matrix LED illumination layer 106.

The illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 extends between the illuminating force sensing surface layer 102 and matrix LED illumination layer 106 with an irregular top surface facing the illuminating force sensing surface layer 102 and receiving the light diffuser 810 and force actuator 820 and an irregular bottom surface facing the matrix LED illumination layer and receiving the LED 850 and sensing node 830.

The illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 is air.

The illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 at the sensing region 704 and the body region 806 therearound is air or a malleable or flexibly resilient or elastomeric material that allows for the force actuator 820 to apply a force to the sensing node 830.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is a reverse mounted LED 850.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is a reverse mounted LED 850 mounted on an LED substrate 851.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is a visible light LED.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is a color light LED.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is a white light LED.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is at least one LED capable of emitting at least one color and/or white light.

The illuminated input sensing device 800 of one of the embodiments, wherein the substrate 840 is a printed circuit board (PCB).

The illuminated input sensing device 800 of one of the embodiments, wherein the substrate 840 is a printed circuit board assembly (PCBA) having one or more electronic components.

The illuminated input sensing device 800 of one of the embodiments, wherein the substrate 840 is a printed circuit board assembly (PCBA) having one or more electronic components selected from an LED controller, LED driver, resistors, integrated circuits, capacitors, or the like.

The illuminated input sensing device 800 of one of the embodiments, having a configuration 800b that includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as a forward LED 852; and the sensing region 704 configured as a substrate 842 in a form of a flexible printed circuit (FPC), wherein the light emitting region 702 and sensing region 704 are separated from each other by the substrate 842a.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 852 is mounted on the substrate 842.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 850 is mounted within a recess in the substrate 840.

The illuminated input sensing device 800 of one of the embodiments, wherein the LED 852 is part of the translucent matrix force sensing layer 104 by being mounted on the substrate 842 laterally or about laterally from the annular sensing node 830.

The illuminated input sensing device 800 of one of the embodiments, wherein components in Figure 6A are also in Figure 6B except for the LED 852 and FPC substrate 842.

The present disclosure is not to be limited in terms of the particular embodiments described in this application, which are intended as illustrations of various aspects. Many modifications and variations can be made without departing from its spirit and scope. Functionally equivalent methods and apparatuses within the scope of the disclosure, in addition to those enumerated herein, are possible from the foregoing descriptions. Such modifications and variations are intended to fall within the scope of the appended claims. The present disclosure is to be limited only by the terms of the appended claims, along with the full scope of equivalents to which such claims are entitled. The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.

With respect to the use of substantially any plural and/or singular terms herein, those having skill in the art can translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. The various singular/plural permutations may be expressly set forth herein for sake of clarity.

It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as“open” terms (e.g., the term“including” should be interpreted as“including but not limited to,” the term“having” should be interpreted as“having at least,” the term “includes” should be interpreted as“includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation, no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases“at least one” and“one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles“a” or“an” limits any particular claim containing such introduced claim recitation to embodiments containing only one such recitation, even when the same claim includes the introductory phrases“one or more” or“at least one” and indefinite articles such as“a” or“an” (e.g.,“a” and/or“an” should be interpreted to mean“at least one” or“one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should be interpreted to mean at least the recited number (e.g., the bare recitation of“two recitations,” without other modifiers, means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to“at least one of A, B, and C, etc.” is used, in general, such a construction is intended in the sense one having skill in the art would understand the convention (e.g.,“a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that virtually any disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase“A or B” will be understood to include the possibilities of“A” or“B” or“A and B.”

In addition, where features or aspects of the disclosure are described in terms of Markush groups, those skilled in the art will recognize that the disclosure is also thereby described in terms of any individual member or subgroup of members of the Markush group.

As will be understood by one skilled in the art, for any and all purposes, such as in terms of providing a written description, all ranges disclosed herein also encompass any and all possible subranges and combinations of subranges thereof. Any listed range can be easily recognized as sufficiently describing and enabling the same range being broken down into at least equal halves, thirds, quarters, fifths, tenths, etc. As a non-limiting example, each range discussed herein can be readily broken down into a lower third, middle third and upper third, etc. As will also be understood by one skilled in the art all language such as“up to,”“at least,” and the like include the number recited and refer to ranges which can be subsequently broken down into subranges as discussed above. Finally, as will be understood by one skilled in the art, a range includes each individual member. Thus, for example, a group having 1-3 cells refers to groups having 1, 2, or 3 cells. Similarly, a group having 1-5 cells refers to groups having 1, 2, 3, 4, or 5 cells, and so forth.

From the foregoing, it will be appreciated that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the following claims.