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Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/149404
Kind Code:
A1
Abstract:
Provided is an imaging device capable of efficiently dissipating heat of an imaging element. An imaging device 100 comprises: an imaging element substrate 4 in which an insulating layer 51 and a conductor layer 52 are laminated and on which an imaging element 41 is mounted; and a casing 1 for housing the imaging element substrate 4 therein. The imaging device is characterized in that: the surface of the imaging element substrate 4 has a mounting region 45 in which an electronic component 43 including the imaging element 41 is mounted, a coating region 46 in which the conductor layer 52 is covered with the insulating layer 51, and an exposed region 47 in which the conductor layer 52 is exposed from the insulating layer 51; and the exposed region 47 is connected to the casing 1.

Inventors:
TAKEUCHI KENICHI (JP)
SHINOHARA HIDENORI (JP)
HAGA TAKESHI (JP)
KATOU SEIICHI (JP)
Application Number:
PCT/JP2020/046667
Publication Date:
July 29, 2021
Filing Date:
December 15, 2020
Export Citation:
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Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/12; H01L23/36; H01L27/146; H04N5/225; H05K1/02; H05K7/20
Domestic Patent References:
WO2018128083A12018-07-12
Foreign References:
JP2012109572A2012-06-07
JP2020010021A2020-01-16
JP2016014564A2016-01-28
Attorney, Agent or Firm:
TODA Yuji (JP)
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