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Patent Searching and Data


Title:
IMAGING ELEMENT AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2022/085406
Kind Code:
A1
Abstract:
[Solution] The present invention provides an imaging element configured as a semiconductor chip, wherein an optical member is provided outside the semiconductor chip, and said imaging element comprises: an acquisition unit for acquiring information regarding the optical member; a pixel unit including N (N is an integer) types of pixels each having different spectral characteristics with respect to the wavelength of input light input via the optical member; a conversion unit that converts an output signal from the pixel unit into a digital output signal; a processing unit that uses the output signal output by the conversion unit as a basis to perform conversion processing of at least N + 1 processing signals each having different spectral characteristics using the aforementioned information; and an output unit that outputs a signal based on the processing signals to the exterior of the semiconductor chip.

Inventors:
NAKATA MASASHI (JP)
SHINOZAKI HIROTAKA (JP)
Application Number:
PCT/JP2021/036646
Publication Date:
April 28, 2022
Filing Date:
October 04, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/369; H04N9/07
Domestic Patent References:
WO2020031655A12020-02-13
WO2010047256A12010-04-29
WO2017141544A12017-08-24
Foreign References:
JP2018098341A2018-06-21
JP2020052378A2020-04-02
JP2007300253A2007-11-15
JP2008136251A2008-06-12
JP2013045917A2013-03-04
Other References:
See also references of EP 4231631A4
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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